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[null,"Standardized Information for Process/Product Change Notification (PCN)"]
[null,"1. PCN basic data",null,null,null,null,null,null,null,null,null,{"$f":"Category!E1","v":"Form  provided  by ZVEI - Revision 5.0"}]
[null,"1.1 Company",null,null,null,null,null,null,null,null,null,null,null,null,"Abfrage Product Category"]
[null,"1.2 PCN No."]
[null,"1.3 Title of PCN"]
[null,"1.4 Product Category ",null,null,null,null,null,null,null,null,null,null,null,null,{"$f":"IF(E6=O20,O9,IF(ISBLANK(E6),\"\",O10))","v":""}]
[null,"1.5 Issue date"]
[null,"1.6 PCN revision history (optional)\n",null,null,"1.7 Issue date of previous revision (optional)",null,"1.8 Delta to previous revision (optional)"]
[null,null,null,null,null,null,null,null,null,null,null,null,null,null,"active"]
[null,null,null,null,null,null,null,null,null,null,null,null,null,null,"passive"]
[]
[]
[null,"2. PCN Team",null,null,null,null,null,null,null,null,null,null,null,null,"Integrated Circuits"]
[null,"2.1 Contact supplier",null,null,null,null,null,null,null,null,null,null,null,null,"Discrete Semiconductors"]
[null,"2.1.1 Name \n",null,null,null,null,null,null,null,null,null,null,null,null,"Networks & Resistors"]
[null,"2.1.2 Phone\n",null,null,null,null,null,null,null,null,null,null,null,null,"Inductors"]
[null,"2.1.3 Email\n",null,null,null,null,null,null,null,null,null,null,null,null,"Quartz Crystal / SAW"]
[null,"2.2 Team supplier (optional)\n",null,null,null,null,null,null,null,null,null,null,null,null,"Ceramic / Tantalum"]
[null,"2.2.1 Name (optional)\n",null,null,"2.2.2 Phone (optional)\n",null,null,"2.2.3 Email (optional)"]
[null,null,null,null,null,null,null,null,null,null,null,null,null,null,"semiconductor components"]
[null,null,null,null,null,null,null,null,null,null,null,null,null,null,"passive and other electronic components"]
[]
[]
[]
[null,"3. Changes"]
[null,"No.","3.0 Ident",null,"3.1 Category",null,null,"3.2 Type of change"]
[null,"#1"]
[null,"#2"]
[null,"#3"]
[null,"#4",null,null,null,null,null,null,null,null,null,null,null,"  "]
[null,"#5"]
[null,"#6"]
[null,"#7"]
[null,"#8"]
[null,"#9",null,null,null,null,null,null,null,null,null,null,null,"  "]
[null,"#10"]
[null,"#11"]
[null,"#12"]
[null,"#13"]
[null,"#14",null,null,null,null,null,null,null,null,null,null,null,"  "]
[null,"#15"]
[null,"#16"]
[null,"#17"]
[null,"#18"]
[null,"#19",null,null,null,null,null,null,null,null,null,null,null,"  "]
[null,"#20"]
[]
[null,"4. Description of change"]
[null,null,null,"Old",null,null,null,"New"]
[null,"Change #1"]
[null,"Change #2"]
[null,"Change #3"]
[null,"Change #4"]
[null,"Change #5"]
[null,"Change #6"]
[null,"Change #7"]
[null,"Change #8"]
[null,"Change #9"]
[null,"Change #10"]
[null,"Change #11"]
[null,"Change #12"]
[null,"Change #13"]
[null,"Change #14"]
[null,"Change #15"]
[null,"Change #16"]
[null,"Change #17"]
[null,"Change #18"]
[null,"Change #19"]
[null,"Change #20"]
[null,"4.1 Anticipated impact on form, fit, function, reliability or processability?"]
[null,"4.2 Reference parts with customer number (optional)"]
[]
[null,"5. Reason / motivation for change"]
[null,"5.1 Motivation",null,null," "]
[null,"5.2 Additional explanation (optional)"]
[]
[null,"6. Marking of parts / traceability of change"]
[null,"6.1 Description"]
[]
[null,"7. Timing / schedule"]
[null,"7.1 Date of qualification results"]
[null,"7.2 Last order date (optional)"]
[null,"7.3 Last delivery date (optional)"]
[null,"7.4 Intended start of delivery"]
[null,"7.5 Qualification samples available?"]
[]
[null,"7.6 Customer feedback required until"]
[]
[null,"8. Qualification / validation"]
[null,"8.1 Description\n(e.g. qual. plan/report, AEC-Q...)"]
[null,"8.2 Qualification report and qualification results",null,null,null,null,null,{"$f":"IF(E91=\"not applicable\",\" \",\"issue date\")","v":"issue date"},null,null,{"$f":"IF(E91=\"will be available at date:\",\"(expected)\",\" \")","v":" "}]
[]
[null,"9. Input to customer for risk assessment process"]
[]
[]
[null,"10. Attachments (e.g. new datasheet, additional documentation, pictures, process flow, sample plan, ...)"]
[]
[]
[null,"11. Affected parts"]
[null,"11.1 Current",null,null,null,null,null,"11.2 New (if applicable)"]
[null,"11.1.1 Customer Part No.\n","11.1.2 Supplier Part Name","11.1.3 \nSupplier Part No. (optional) ","11.1.4 Package Name","11.1.5 \nPart Description (optional)","11.1.6\nAdditional Part \nInformation (optional)","11.2.2 Supplier Part Name","11.2.3 \nSupplier Part No. (optional) ","11.2.4 Package Name","11.2.6\nAdditional Part \nInformation (optional)"]
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{"sheet":"ExamplePCN","index":1,"n_rows":84,"n_cols":12,"rows_kept":84,"cut":false,"hidden":false,"merged":[[59,1,59,10],[60,1,60,10],[62,1,62,10],[63,1,63,10],[65,1,65,10],[66,1,66,6],[66,7,66,10],[53,1,53,3],[53,4,53,5],[53,6,53,10],[55,1,55,10],[56,1,56,3],[56,4,56,10],[57,1,57,3],[57,4,57,6],[57,8,57,9],[49,1,49,3],[49,4,49,5],[49,6,49,10],[50,1,50,3],[50,4,50,5],[50,6,50,10],[51,1,52,3],[51,4,51,10],[52,4,52,10],[44,1,44,3],[44,4,44,10],[46,1,46,10],[47,1,47,3],[47,4,47,5],[47,6,47,10],[48,1,48,3],[48,4,48,5],[48,6,48,10],[40,1,40,3],[40,4,40,10],[36,3,36,6],[36,7,36,10],[37,3,37,6],[37,7,37,10],[41,1,41,3],[41,4,41,10],[43,1,43,10],[34,1,34,2],[34,3,34,6],[34,7,34,10],[35,1,35,2],[35,3,35,6],[35,7,35,10],[36,1,36,2],[37,1,37,2],[39,1,39,10],[31,1,31,2],[31,3,31,6],[31,7,31,10],[32,1,32,2],[32,3,32,6],[32,7,32,10],[33,1,33,2],[33,3,33,6],[33,7,33,10],[26,2,26,3],[26,4,26,6],[26,7,26,10],[27,2,27,3],[27,4,27,6],[27,7,27,10],[29,1,29,10],[30,1,30,2],[30,3,30,6],[30,7,30,10],[21,1,21,3],[21,4,21,6],[21,7,21,10],[22,1,22,3],[22,4,22,6],[22,7,22,10],[24,1,24,10],[25,2,25,3],[25,4,25,6],[25,7,25,10],[18,1,18,3],[18,4,18,6],[18,7,18,10],[19,1,19,3],[19,4,19,6],[19,7,19,10],[20,1,20,3],[20,4,20,6],[20,7,20,10],[12,1,12,10],[13,1,13,10],[14,1,14,3],[14,4,14,10],[15,1,15,3],[15,4,15,10],[16,1,16,3],[16,4,16,10],[17,1,17,10],[8,1,8,3],[8,4,8,5],[8,6,8,10],[9,1,9,3],[9,4,9,5],[9,6,9,10],[10,1,10,3],[10,4,10,5],[10,6,10,10],[0,1,0,10],[1,1,1,10],[1,11,7,11],[2,2,2,3],[2,4,2,10],[3,1,3,3],[3,4,3,10],[4,1,4,3],[4,4,4,10],[5,1,5,3],[5,4,5,10],[6,1,6,3],[6,4,6,10],[7,1,7,3],[7,4,7,5],[7,6,7,10]]}
[null,"Standardized Information for Process/Product Change Notification (PCN)"]
[null,"1. PCN basic data",null,null,null,null,null,null,null,null,null,{"$f":"Category!E1","v":"Form  provided  by ZVEI - Revision 5.0"}]
[null,"1.1 Company",null,null,"\nYour company’s name and address "]
[null,"1.2 PCN No.",null,null,"e.g. CM123456"]
[null,"1.3 Title of PCN",null,null,"e.g. Change of mold compound into green mold for SOT23"]
[null,"1.4 Product Category "]
[null,"1.5 Issue date",null,null,"2015-01-01"]
[null,"1.6 PCN revision history (optional)\n",null,null,"1.7 Issue date of previous revision (optional)",null,"1.8 Delta to previous revision (optional)"]
[null,"e.g. CM1234566",null,null,"2014-10-10",null,"e.g. Change of mold compound into green mold for D2PAK"]
[]
[]
[]
[null,"2. PCN Team"]
[null,"2.1 Contact supplier"]
[null,"2.1.1 Name \n",null,null,"Mr. Mustermann"]
[null,"2.1.2 Phone\n",null,null,"+49 123 456789"]
[null,"2.1.3 Email\n",null,null,"max.mustermann@newcompany.com"]
[null,"2.2 Team supplier (optional)\n"]
[null,"2.2.1 Name (optional)\n",null,null,"2.2.2 Phone (optional)\n",null,null,"2.2.3 Email (optional)"]
[null,"Carl Clever",null,null,"+49 123 987654",null,null,"carl.clever@newcompany.com"]
[]
[]
[]
[]
[null,"3. Changes"]
[null,"No.","3.0 Ident",null,"3.1 Category",null,null,"3.2 Type of change"]
[null,"#1","SEM-DS-02",null,"DATA SHEET",null,null,"Correction of data sheet / errata"]
[null,"#2","SEM-PA-11",null,"PROCESS - ASSEMBLY",null,null,"Change of mold compound"]
[]
[null,"4. Description of change"]
[null,null,null,"Old",null,null,null,"New"]
[null,"Change #1",null,"Old mold compound is not longer RoHS compatible. ",null,null,null," New mold compound will fulfill RoHS requirements."]
[null,"Change #2",null,"Old mold compound is not longer RoHS compatible. ",null,null,null,"New datasheet will give hint to RoHS compatibility."]
[null,"Change #3"]
[null,"Change #4"]
[null,"Change #5"]
[null,"4.6 Anticipated impact on form, fit, function, reliability or processability?",null,"e.g. Change in mold compound could have influence in reliability and processability / manufacturability."]
[null,"4.7 Reference parts with customer number (optional)",null,"e.g. PHB series, PSM series"]
[]
[null,"5. Reason / motivation for change"]
[null,"5.1 Motivation",null,null," e.g. Change to RoHS compatible mold compound because of legal restrictions."]
[null,"5.2 Additional explanation (optional)"]
[]
[null,"6. Marking of parts / traceability of change"]
[null,"6.1 Description",null,null,"e.g. Marking will added with the letter G."]
[]
[null,"7. Timing / schedule"]
[null,"7.1 Date of qualification results",null,null,"2010-06-01"]
[null,"7.2 Last order date (optional)",null,null,"2013-01-31"]
[null,"7.3 Last delivery date (optional)",null,null,"2013-06-30"]
[null,"7.4 Intended start of delivery",null,null,"2012-06-01"]
[null,"7.5 Qualification samples available?",null,null,"Yes, available (date and/or types):"]
[null,null,null,null,"e.g. BAS21"]
[null,"7.6 Customer feedback required until",null,null,"2012-02-01"]
[]
[null,"8. Qualification / validation"]
[null,"8.1 Description\n(e.g. qual. plan/report, AEC-Q...)",null,null,"e.g. AEC-Q101"]
[null,"8.2 Qualification report and qualification results",null,null,"available (see attachement)",null,null,{"$f":"IF(E58=\"not applicable\",\" \",\"issue date\")","v":"issue date"},null,null,{"$f":"IF(E58=\"will be available at date:\",\"(expected)\",\" \")","v":" "}]
[]
[null,"9. Input to customer for risk assessment process"]
[]
[]
[null,"10. Attachments (e.g. new datasheet, additional documentation, pictures, process flow, sample plan, ...)"]
[]
[]
[null,"11. Affected parts"]
[null,"11.1 Current",null,null,null,null,null,"11.2 New (if applicable)"]
[null,"11.1.1 Customer Part No.\n","11.1.2 Supplier Part Name","11.1.3 \nSupplier Part No. (optional) ","11.1.4 Package Name","11.1.5 \nPart Description (optional)","11.1.6\nAdditional Part \nInformation (optional)","11.2.2 Supplier Part Name","11.2.3 \nSupplier Part No. (optional) ","11.2.4 Package Name","11.2.6\nAdditional Part \nInformation (optional)"]
[null,890400001,"BAS10","555 444 002","SOT23","diode","see Chap. 10","BAS10-G","555 445 002","SOT23","see Chap. 10"]
[null,890400002,"BAS20","555 444 004","SOT23","diode","see Chap. 10","BAS20-G","555 445 004","SOT23","see Chap. 10"]
[null,890400003,"BAS30","555 444 006","SOT23","diode","see Chap. 10","BAS30-G","555 445 006","SOT23","see Chap. 10"]
[null,890400004,"BAS40","555 444 008","SOT23","diode","see Chap. 10","BAS40-G","555 445 008","SOT23","see Chap. 10"]
[null,890400005,"BAS50","555 444 010","SOT23","diode","see Chap. 10","BAS50-G","555 445 010","SOT23","see Chap. 10"]
[null,890400006,"BAS60","555 444 012","SOT23","diode","see Chap. 10","BAS60-G","555 445 012","SOT23","see Chap. 10"]
[null,890400007,"BZX84B01","556 434 010","SOT23","diode","see Chap. 10","BZX84B01-G","556 435 010","SOT23","see Chap. 10"]
[null,890400008,"BZX84B02","556 434 012","SOT23","diode","see Chap. 10","BZX84B02-G","556 435 012","SOT23","see Chap. 10"]
[null,890400009,"BZX84B03","556 434 014","SOT23","diode","see Chap. 10","BZX84B03-G","556 435 014","SOT23","see Chap. 10"]
[null,890400010,"BZX84B04","556 434 016","SOT23","diode","see Chap. 10","BZX84B04-G","556 435 016","SOT23","see Chap. 10"]
[null,890400011,"BZX84B05","556 434 018","SOT23","diode","see Chap. 10","BZX84B05-G","556 435 018","SOT23","see Chap. 10"]
[null,890400012,"BZX84B06","556 434 020","SOT23","doide","see Chap. 10","BZX84B06-G","556 435 020","SOT23","see Chap. 10"]
[null,890400013,"BZX84B07","556 434 022","SOT23","diode","see Chap. 10","BZX84B07-G","556 435 022","SOT23","see Chap. 10"]
[null,890400014,"BZX84B08","556 434 024","SOT23","diode","see Chap. 10","BZX84B08-G","556 435 024","SOT23","see Chap. 10"]
[null,890400015,"BZX84B09","556 434 026","SOT23","diode","see Chap. 10","BZX84B09-G","556 435 026","SOT23","see Chap. 10"]
[null,890400016,"BZX84B10","556 434 028","SOT23","diode","see Chap. 10","BZX84B10-G","556 435 028","SOT23","see Chap. 10"]

{"sheet":"Customer Feedback","index":2,"n_rows":40,"n_cols":11,"rows_kept":40,"cut":false,"hidden":false,"merged":[[1,9,6,9],[3,1,3,2],[19,1,20,1],[3,5,3,6],[18,2,18,8],[15,2,16,8],[4,1,4,8],[15,1,16,1],[19,2,19,8],[3,7,3,8],[6,2,6,4],[6,6,6,8],[14,2,14,4],[14,6,14,8],[12,2,12,8],[10,2,10,8],[0,0,122,0],[1,1,1,8],[0,1,0,8],[2,1,2,8],[8,2,8,8],[26,1,26,8],[28,3,28,8],[7,2,7,8],[29,3,29,8],[3,3,3,4],[9,2,9,8],[17,2,17,8],[17,1,18,1],[24,1,25,1],[22,2,22,8],[21,2,21,8],[11,1,12,1],[11,2,11,8],[9,1,10,1],[21,1,22,1],[25,2,25,8],[24,2,24,4],[24,6,24,8],[20,2,20,8],[39,1,39,2],[32,3,32,8],[30,1,30,2],[31,3,31,8],[39,3,39,8],[37,1,37,2],[37,3,37,8],[36,1,36,2],[36,3,36,8],[33,1,33,8],[34,1,34,8],[38,1,38,2],[38,3,38,8],[32,1,32,2],[35,1,35,2],[35,3,35,8],[27,1,27,8],[31,1,31,2],[28,1,28,2],[29,1,29,2],[30,3,30,8]]}
[null,"Customer Feedback/Approval Form"]
[null,"Title of PCN:",null,null,null,null,null,null,null,{"$f":"Category!E1","v":"Form  provided  by ZVEI - Revision 5.0"}]
[null,{"$f":"IF(PCN!E5=\"\",\"\",PCN!E5)","v":""}]
[null,"Customer PCN No.",null,null,null,"Supplier PCN No.",null,{"$f":"IF(PCN!E4=\"\",\"\",PCN!E4)","v":""}]
[null,"Please check the appropriate box below:"]
[]
[null,null,"1. Feedback",null,null,"date:"]
[null,null,"We agree with this proposed change for the parts as listed in chapter '11. Affected parts'.\nApproval letter will be sent in written form.",null,null,null,null,null,null,null," "]
[null,null,"We agree with this proposed change schedule and will start with the PCN process. Approval letter will be sent in written form after evaluation."]
[null,null,"We disapprove because:"]
[null,null,null,null,null,null,null,null,null,null," "]
[null,null,"Remark:"]
[]
[]
[null,null,"2. Feedback",null,null,"date:"]
[null,null,"We acknowledge qualification / validation as assigned in chapter 8 of the PCN."]
[]
[null,null,"We need more information:",null,null,null,null,null,null,null," "]
[]
[null," ","We need the following samples:"]
[]
[null,null,"Estimated closing date for PCN:"]
[null," "]
[]
[null,null,"Final Feedback/Approval",null,null,"date:"]
[]
[]
[null,"Sender:                                        "]
[null,"Company:              "]
[null,"Name:"]
[null,"Address/Location:"]
[null,"Signature:                                                          "]
[null,"Date:"]
[]
[null,"Please return to: [your Sales partner]                          "]
[null,"Name:",null,{"$f":"IF(PCN!E15=\"\",\"\",PCN!E15)","v":""}]
[null,"Address/Location:"]
[null,"Phone:",null,{"$f":"IF(PCN!E16=\"\",\"\",PCN!E16)","v":""}]
[null,"Fax:"]
[null,"Email:",null,{"$f":"IF(PCN!E17=\"\",\"\",PCN!E17)","v":""}]

{"sheet":"Category","index":3,"n_rows":17,"n_cols":5,"rows_kept":17,"cut":false,"hidden":true,"merged":[]}
[null,null,"Yes, available (date and/or types):",null,"Form  provided  by ZVEI - Revision 5.0"]
["Active Components – Integrated Circuits ",null,"not applicable because:","available (see attachement)"]
["Active Components – Discrete Components ",null,null,"will be available at date"]
["Optoelectronic Components - LED",null,null,"not applicable"]
["Optoelectronic Components - LD"]
["Optoelectronic Components - PD"]
["MCM"]
["Passive Components – Networks & Resisitors"]
["Passive Components – Inductors"]
["Passive Components – Ceramic / Tantalum"]
["Passive Components – Film Capacitors"]
["Passive Components – Quarz Crystal / SAW"]
["Passive Components – AL-Cap"]
["Passive Components – NTC"]
["Passive Components – PTC"]
["Passive Components – VDR"]
["MEMS"]

{"sheet":"1","index":4,"n_rows":64,"n_cols":5,"rows_kept":64,"cut":false,"hidden":true,"merged":[]}
[]
[null,null,"ID","Type","Remarks"]
[null,null,"SEM-AN-01","ANY","Any change with impact on agreed upon technical contractual agreements"]
[null,null,"SEM-AN-02","ANY","Any change with impact on processability/manufacturability at customer, which is not covered in the matrix below."]
[null,null,"SEM-DS-01","DATA SHEET","Change of datasheet parameters/electrical specification (min./max./typ. values) and/or AC/DC specification"]
[null,null,"SEM-DS-02","DATA SHEET","Correction of data sheet or issue of errata"]
[null,null,"SEM-DS-03","DATA SHEET","Specification of additional parameters"]
[null,null,"SEM-DE-01","DESIGN","Design changes in active elements."]
[null,null,"SEM-DE-02","DESIGN","Design changes in routing ."]
[null,null,"SEM-DE-03","DESIGN","Die shrink "]
[null,null,"SEM-DE-04","DESIGN","Firmeware modification"]
[null,null,"SEM-PW-01","PROCESS - WAFER PRODUCTION","New / change of wafer substrate material"]
[null,null,"SEM-PW-02","PROCESS - WAFER PRODUCTION","New wafer diameter"]
[null,null,"SEM-PW-03","PROCESS - WAFER PRODUCTION","New final wafer thickness"]
[null,null,"SEM-PW-04","PROCESS - WAFER PRODUCTION","Change of electrically active doping/implantation element"]
[null,null,"SEM-PW-05","PROCESS - WAFER PRODUCTION","Change of gate material / dielectrics"]
[null,null,"SEM-PW-06","PROCESS - WAFER PRODUCTION","New / change of backside operation (grinding / metallization) "]
[null,null,"SEM-PW-07","PROCESS - WAFER PRODUCTION","New / change of metallization / vias / contacts"]
[null,null,"SEM-PW-08","PROCESS - WAFER PRODUCTION","New / change of passivation or die coating (without bare die)"]
[null,null,"SEM-PW-09","PROCESS - WAFER PRODUCTION","Change in process technology not covered by any other type of change"]
[null,null,"SEM-PW-10","PROCESS - WAFER PRODUCTION","Process integrity: tuning within process specification"]
[null,null,"SEM-PW-11","PROCESS - WAFER PRODUCTION","Change of wafer supplier."]
[null,null,"SEM-PW-12","PROCESS - WAFER PRODUCTION","Change of specified wafer process sequence (deletion and/or additional process step)"]
[null,null,"SEM-PW-13","PROCESS - WAFER PRODUCTION","Move all or parts of production to a different wafer fab site."]
[null,null,"SEM-PW-14","PROCESS - WAFER PRODUCTION","Lithography"]
[null,null,"SEM-PW-15","PROCESS - WAFER PRODUCTION","Oxide / Interlayer Dielectric (excl. gate oxide)"]
[null,null,"SEM-BD-01","BARE DIE","New final wafer thickness"]
[null,null,"SEM-BD-02","BARE DIE","Change of top metallization or bond pad stack"]
[null,null,"SEM-BD-03","BARE DIE","New / change of backside metallization"]
[null,null,"SEM-BD-04","BARE DIE","Change of wafer setup or number of possible good dies on wafer."]
[null,null,"SEM-BD-05","BARE DIE","Change of optical appearance of wafer edge region (like imide coverage or edge exclusion)"]
[null,null,"SEM-BD-06","BARE DIE","Die scribe or separation"]
[null,null,"SEM-BD-07","BARE DIE","Die Preparation / Clean"]
[null,null,"SEM-BD-08","BARE DIE","New / change of passivation or die coating "]
[null,null,"SEM-PA-01","PROCESS - ASSEMBLY","Change in critical dimensions of package"]
[null,null,"SEM-PA-02","PROCESS - ASSEMBLY","Change of leadframe base material"]
[null,null,"SEM-PA-03","PROCESS - ASSEMBLY","Change in leadframe dimensions"]
[null,null,"SEM-PA-04","PROCESS - ASSEMBLY","Change of lead frame finishing material / area (internal)"]
[null,null,"SEM-PA-05","PROCESS - ASSEMBLY","Change of lead and heat slug plating material/plating thickness (external)"]
[null,null,"SEM-PA-06","PROCESS - ASSEMBLY","Bump Material / Metal System (internal)"]
[null,null,"SEM-PA-07","PROCESS - ASSEMBLY","Die attach material"]
[null,null,"SEM-PA-08","PROCESS - ASSEMBLY","Change of wire bonding\n"]
[null,null,"SEM-PA-09","PROCESS - ASSEMBLY","Substrate / Interposer"]
[null,null,"SEM-PA-10","PROCESS - ASSEMBLY","Die Overcoat / Underfill"]
[null,null,"SEM-PA-11","PROCESS - ASSEMBLY","Change of mold compound / encapsulation material"]
[null,null,"SEM-PA-12","PROCESS - ASSEMBLY","Change of hermetic sealing"]
[null,null,"SEM-PA-13","PROCESS - ASSEMBLY","Change of product marking"]
[null,null,"SEM-PA-14","PROCESS - ASSEMBLY","Change in process technology\n(e.g. trim and form, leadframe preparation …)"]
[null,null,"SEM-PA-15","PROCESS - ASSEMBLY","Process integrity: tuning within process specification"]
[null,null,"SEM-PA-16","PROCESS - ASSEMBLY","Change of direct material supplier"]
[null,null,"SEM-PA-17","PROCESS - ASSEMBLY","Change of specified assembly process sequence (deletion and/or additional process step)"]
[null,null,"SEM-PA-18","PROCESS - ASSEMBLY"," Move all or parts of production to a different assembly site."]
[null,null,"SEM-PA-19","PROCESS - ASSEMBLY","Die scribe or separation"]
[null,null,"SEM-PA-20","PROCESS - ASSEMBLY","Die Preparation / Clean"]
[null,null,"SEM-PA-21","PROCESS - ASSEMBLY","Molding / Encapsulation process"]
[null,null,"SEM-PS-01","PACKING/SHIPPING","Packing/shipping specification change"]
[null,null,"SEM-PS-02","PACKING/SHIPPING","Dry pack requirements change "]
[null,null,"SEM-PS-03","PACKING/SHIPPING","Change of carrier (tray, reel)"]
[null,null,"SEM-PS-04","PACKING/SHIPPING","Change of labelling"]
[null,null,"SEM-EQ-01","EQUIPMENT","Production from a new equipment/tool which uses a different basic technology or which due to its unique form or function can be expected to influence the integrity of the final product"]
[null,null,"SEM-EQ-02","EQUIPMENT","Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool) without change of process."]
[null,null,"SEM-EQ-03","EQUIPMENT","Change in final test equipment type leading to a different test concept."]
[null,null,"SEM-TF-01","TEST FLOW","Move of all or part of electrical wafer test and/or final test to a different test site."]
[null,null,"SEM-QG-01","Q-GATE","Change of the test coverage/testing process flow used by the supplier to ensure data sheet compliance (e.g. elimination/addition of electrical measurement/test flow block; relaxation/enhancement of monitoring procedure or sampling)"]

{"sheet":"2","index":5,"n_rows":64,"n_cols":5,"rows_kept":64,"cut":false,"hidden":true,"merged":[]}
[]
[null,null,"ID","Type","Remarks"]
[null,null,"SEM-AN-01","ANY","Any change with impact on agreed upon contractual agreements"]
[null,null,"SEM-AN-02","ANY","Any change with impact on processability/manufacturabiliy at customer, which is not covered in the matrix below."]
[null,null,"SEM-DS-01","DATA SHEET","Change of datasheet parameters/electrical specification (min./max./typ. values) and/or AC/DC specification"]
[null,null,"SEM-DS-02","DATA SHEET","Correction of data sheet / errata"]
[null,null,"SEM-DS-03","DATA SHEET","Specification of additional parameters"]
[null,null,"SEM-DE-01","DESIGN","Design changes in active elements."]
[null,null,"SEM-DE-02","DESIGN","Design changes in routing ."]
[null,null,"SEM-DE-03","DESIGN","Die shrink "]
[null,null,"SEM-DE-04","DESIGN","Firmeware modification"]
[null,null,"SEM-PW-01","PROCESS - WAFER PRODUCTION","New / change of wafer substrate material"]
[null,null,"SEM-PW-02","PROCESS - WAFER PRODUCTION","New wafer diameter"]
[null,null,"SEM-PW-03","PROCESS - WAFER PRODUCTION","New final wafer thickness"]
[null,null,"SEM-PW-04","PROCESS - WAFER PRODUCTION","Change of electrically active doping/implantation element"]
[null,null,"SEM-PW-05","PROCESS - WAFER PRODUCTION","Change of gate material / dielectrics"]
[null,null,"SEM-PW-06","PROCESS - WAFER PRODUCTION","New / change of metallization (specifically chip backside)"]
[null,null,"SEM-PW-07","PROCESS - WAFER PRODUCTION","New / change of metallization (specifically chip frontside)"]
[null,null,"SEM-PW-08","PROCESS - WAFER PRODUCTION","New / change of passivation or die coating (without bare die)"]
[null,null,"SEM-PW-09","PROCESS - WAFER PRODUCTION","Change in process technology (e. g. process changes like lithography, etch, oxide deposition, diffusion, die back surface preparation/backgrind, ...)"]
[null,null,"SEM-PW-10","PROCESS - WAFER PRODUCTION","Process integrity: tuning within process specification"]
[null,null,"SEM-PW-11","PROCESS - WAFER PRODUCTION","Change of wafer supplier."]
[null,null,"SEM-PW-12","PROCESS - WAFER PRODUCTION","Change of specified wafer process sequence (deletion and/or additional process step)"]
[null,null,"SEM-PW-13","PROCESS - WAFER PRODUCTION","Move of all or part of wafer fab to a different location/site/subcontractor"]
[null,null,"SEM-PW-14","PROCESS - WAFER PRODUCTION","Lithography"]
[null,null,"SEM-PW-15","PROCESS - WAFER PRODUCTION","Oxide / Interlayer Dielectric (excl. gate oxide)"]
[null,null,"SEM-BD-01","BARE DIE","New final wafer thickness"]
[null,null,"SEM-BD-02","BARE DIE","New / change of frontside metallization"]
[null,null,"SEM-BD-03","BARE DIE","New / change of backside metallization"]
[null,null,"SEM-BD-04","BARE DIE","Change of wafer setup or number of possible good dies on wafer."]
[null,null,"SEM-BD-05","BARE DIE","Change of optical appearance of wafer edge region (like imide coverage or edge exclusion)"]
[null,null,"SEM-BD-06","BARE DIE","Die scribe or separation"]
[null,null,"SEM-BD-07","BARE DIE","Die Preparation / Clean"]
[null,null,"SEM-BD-08","BARE DIE","New / change of passivation or die coating "]
[null,null,"SEM-PA-01","PROCESS - ASSEMBLY","Change in critical dimensions of package"]
[null,null,"SEM-PA-02","PROCESS - ASSEMBLY","Change of leadframe base material"]
[null,null,"SEM-PA-03","PROCESS - ASSEMBLY","Change in leadframe dimensions"]
[null,null,"SEM-PA-04","PROCESS - ASSEMBLY","Change of lead frame finishing material / area (internal)"]
[null,null,"SEM-PA-05","PROCESS - ASSEMBLY","Change of lead and heat slug plating material/plating thickness (external)"]
[null,null,"SEM-PA-06","PROCESS - ASSEMBLY","Bump Material / Metall System (internal)"]
[null,null,"SEM-PA-07","PROCESS - ASSEMBLY","Die attach material"]
[null,null,"SEM-PA-08","PROCESS - ASSEMBLY","Change of wire bonding\n"]
[null,null,"SEM-PA-09","PROCESS - ASSEMBLY","Substrate / Interposer"]
[null,null,"SEM-PA-10","PROCESS - ASSEMBLY","Die Overcoat / Underfill"]
[null,null,"SEM-PA-11","PROCESS - ASSEMBLY","Change of mold compound / encapsulation material"]
[null,null,"SEM-PA-12","PROCESS - ASSEMBLY","Change of hermetic sealing"]
[null,null,"SEM-PA-13","PROCESS - ASSEMBLY","Change of product marking"]
[null,null,"SEM-PA-14","PROCESS - ASSEMBLY","Change in process technology\n(e.g. sawing, die attach, bonding, moulding, plating, trim and form, lead frame preperation,  …)"]
[null,null,"SEM-PA-15","PROCESS - ASSEMBLY","Process integrity: tuning within process specification"]
[null,null,"SEM-PA-16","PROCESS - ASSEMBLY","Change of direct material supplier"]
[null,null,"SEM-PA-17","PROCESS - ASSEMBLY","Change of specified assembly process sequence (deletion and/or additional process step)"]
[null,null,"SEM-PA-18","PROCESS - ASSEMBLY","Move of all or part of assembly to a different location/site/subcontractor."]
[null,null,"SEM-PA-19","PROCESS - ASSEMBLY","Die scribe or separation"]
[null,null,"SEM-PA-20","PROCESS - ASSEMBLY","Die Preparation / Clean"]
[null,null,"SEM-PA-21","PROCESS - ASSEMBLY","Molding / Encapsulation process"]
[null,null,"SEM-PS-01","PACKING/SHIPPING","Packing/shipping specification change"]
[null,null,"SEM-PS-02","PACKING/SHIPPING","Dry pack requirements change "]
[null,null,"SEM-PS-03","PACKING/SHIPPING","Change of carrier (tray, reel)"]
[null,null,"SEM-PS-04","PACKING/SHIPPING","Change of labelling"]
[null,null,"SEM-EQ-01","EQUIPMENT","Production from a new equipment/tool which uses a different basic technology or which due to its unique form or function can be expected to influence the integrity of the final product"]
[null,null,"SEM-EQ-02","EQUIPMENT","Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool) without change of process."]
[null,null,"SEM-EQ-03","EQUIPMENT","Change in test equipment type that uses a different technology"]
[null,null,"SEM-TF-01","TEST FLOW","Move of all or part of electrical wafer test and/or final test to a different location/site/subcontractor"]
[null,null,"SEM-QG-01","Q-GATE","Change of the test coverage/testing process flow used by the supplier to ensure data sheet compliance (e.g. elimination/addition of electrical measurement/test flow block; relaxation/enhancement of monitoring procedure or sampling)"]

{"sheet":"3","index":6,"n_rows":57,"n_cols":5,"rows_kept":57,"cut":false,"hidden":true,"merged":[]}
[]
[null,null,"ID","Type","Remarks"]
[null,null,"OEC-LED-AN-01","ANY","Any change with impact on agreed upon technical contractual agreements"]
[null,null,"OEC-LED-AN-02","ANY","Any change with impact on technical interface or processability/manufacturability of customer, which is not covered in the matrix below"]
[null,null,"OEC-LED-DS-01","DATA SHEET","Change of datasheet parameters/electrical specification (min./max./typ. values) and/or Pulse/DC specification "]
[null,null,"OEC-LED-DS-02","DATA SHEET","Correction of data sheet or issue of errata"]
[null,null,"OEC-LED-DS-03","DATA SHEET","Specification of additional parameters "]
[null,null,"OEC-LED-DE-01","DESIGN","Design changes in epitaxy."]
[null,null,"OEC-LED-DE-02","DESIGN","Design changes in routing/layout."]
[null,null,"OEC-LED-DE-03","DESIGN","Die shrink "]
[null,null,"OEC-LED-DE-04","DESIGN","LED package (except leadframe)"]
[null,null,"OEC-LED-DE-05","DESIGN","Design of leadframe "]
[null,null,"OEC-LED-PW-01","PROCESS - WAFER PRODUCTION","New / change of wafer substrate or carrier material"]
[null,null,"OEC-LED-PW-02","PROCESS - WAFER PRODUCTION","Wafer diameter"]
[null,null,"OEC-LED-PW-03","PROCESS - WAFER PRODUCTION","New final wafer thickness"]
[null,null,"OEC-LED-PW-04","PROCESS - WAFER PRODUCTION","Change of electrically active doping/implantation element"]
[null,null,"OEC-LED-PW-05","PROCESS - WAFER PRODUCTION","Change of stacking"]
[null,null,"OEC-LED-PW-06","PROCESS - WAFER PRODUCTION","New / change of metallization (specifically chip frontside)"]
[null,null,"OEC-LED-PW-07","PROCESS - WAFER PRODUCTION","New / change of metallization (specifically chip backside)"]
[null,null,"OEC-LED-PW-08","PROCESS - WAFER PRODUCTION","Change in process technique (e.g. significant process changes like lithography, etch, oxide deposition, die back surface preparation/backgrind, ...)"]
[null,null,"OEC-LED-PW-09","PROCESS - WAFER PRODUCTION","Process Integrity: Tuning within specification"]
[null,null,"OEC-LED-PW-10","PROCESS - WAFER PRODUCTION","Change of material supplier with no impact on agreed specifications"]
[null,null,"OEC-LED-PW-11","PROCESS - WAFER PRODUCTION","Change of specified wafer process sequence (deletion and/or additional process step)"]
[null,null,"OEC-LED-PW-12","PROCESS - WAFER PRODUCTION","Change in die coating or passivaton"]
[null,null,"OEC-LED-PW-13","PROCESS - WAFER PRODUCTION","New wafer production location or transfer of wafer production to a different not previously released location/site/subcontractor "]
[null,null,"OEC-LED-BD-01","BARE DIE DELIVERIES","New / change of front side metallization"]
[null,null,"OEC-LED-BD-02","BARE DIE DELIVERIES","New / change of backside metallization"]
[null,null,"OEC-LED-BD-03","BARE DIE DELIVERIES","Change of wafer setup or number of dies on wafer."]
[null,null,"OEC-LED-BD-04","BARE DIE DELIVERIES","New final wafer thickness"]
[null,null,"OEC-LED-BD-05","BARE DIE DELIVERIES","Change in die coating or passivation"]
[null,null,"OEC-LED-PA-01","PROCESS - ASSEMBLY","Change of leadframe/carrier base material"]
[null,null,"OEC-LED-PA-02","PROCESS - ASSEMBLY","Change of leadframe/carrier finishing material (internal)"]
[null,null,"OEC-LED-PA-03","PROCESS - ASSEMBLY","Change of lead and heat slug plating material/plating thickness (external)"]
[null,null,"OEC-LED-PA-04","PROCESS - ASSEMBLY","Bump Material / Metall System (internal)"]
[null,null,"OEC-LED-PA-05","PROCESS - ASSEMBLY","Die attach material"]
[null,null,"OEC-LED-PA-06","PROCESS - ASSEMBLY","Change of bond wire material"]
[null,null,"OEC-LED-PA-07","PROCESS - ASSEMBLY","Change in material for sub-components (excluding LED chip & LED package related items) with impact on agreed specifications"]
[null,null,"OEC-LED-PA-08","PROCESS - ASSEMBLY","Die Overcoat / Underfill"]
[null,null,"OEC-LED-PA-09","PROCESS - ASSEMBLY","Change of mold compound/encapsulation/sealing material"]
[null,null,"OEC-LED-PA-10","PROCESS - ASSEMBLY","Change of conversion material"]
[null,null,"OEC-LED-PA-11","PROCESS - ASSEMBLY","Change of direct supplier for converter material"]
[null,null,"OEC-LED-PA-12","PROCESS - ASSEMBLY","Change of converter process technology"]
[null,null,"OEC-LED-PA-13","PROCESS - ASSEMBLY","Change of product marking"]
[null,null,"OEC-LED-PA-14","PROCESS - ASSEMBLY","Change in process technique (e.g., die attach, bonding, moulding, plating, trim and form, …)"]
[null,null,"OEC-LED-PA-15","PROCESS - ASSEMBLY","Process Integrity: Tuning within specification"]
[null,null,"OEC-LED-PA-16","PROCESS - ASSEMBLY","Change of direct material supplier with no impact on specification"]
[null,null,"OEC-LED-PA-17","PROCESS - ASSEMBLY","Change of specified assembly process sequence (additional and/or deletion of process step)"]
[null,null,"OEC-LED-PA-18","PROCESS - ASSEMBLY","New assembly location or transfer of assembly to a different not previously released location/site/subcontractor "]
[null,null,"OEC-LED-PS-01","PACKING/SHIPPING","Outer Packing/shipping specification change"]
[null,null,"OEC-LED-PS-02","PACKING/SHIPPING","Dry pack requirement change"]
[null,null,"OEC-LED-PS-03","PACKING/SHIPPING","Inner Packing/shipping specification change"]
[null,null,"OEC-LED-PS-04","PACKING/SHIPPING","Change of labelling"]
[null,null,"OEC-LED-EQ-01","EQUIPMENT","Production from a new equipment/tool which uses a different basic technology "]
[null,null,"OEC-LED-EQ-02","EQUIPMENT","Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool) without change of process."]
[null,null,"OEC-LED-EQ-03","EQUIPMENT","Change in final test equipment type that uses a different technology"]
[null,null,"OEC-LED-TF-01","TEST FLOW","Move of all or part of electrical wafer test and/or final test to a different location/site/subcontractor"]
[null,null,"OEC-LED-QG-01","Q-GATE","Change of the test coverage/testing process flow used by the supplier to ensure data sheet compliance (e.g. elimination/addition of electrical measurement/test flow block; relaxation/enhancement of monitoring procedure or sampling)"]

{"sheet":"4","index":7,"n_rows":61,"n_cols":5,"rows_kept":61,"cut":false,"hidden":true,"merged":[]}
[]
[null,null,"ID","Type","Remarks"]
[null,null,"OEC-LAS-AN-01","ANY","Any change with impact on agreed upon technical contractual agreements"]
[null,null,"OEC-LAS-AN-02","ANY","Any change with impact on technical interface or processability/manufacturabiliy of customer, which is not covered in the matrix below"]
[null,null,"OEC-LAS-DS-01","DATA SHEET","Change of datasheet parameters/electrical specification (min./max./typ. values) and/or Pulse/DC specification "]
[null,null,"OEC-LAS-DS-02","DATA SHEET","Correction of data sheet or issue of errata"]
[null,null,"OEC-LAS-DS-03","DATA SHEET","Specification of additional parameters "]
[null,null,"OEC-LAS-DE-01","DESIGN","Design changes in epitaxy."]
[null,null,"OEC-LAS-DE-02","DESIGN","Design changes in routing/layout."]
[null,null,"OEC-LAS-DE-03","DESIGN","Die shrink "]
[null,null,"OEC-LAS-DE-04","DESIGN","Laser package (except leadframe)"]
[null,null,"OEC-LAS-DE-05","DESIGN","Design of leadframe "]
[null,null,"OEC-LAS-PW-01","PROCESS - WAFER PRODUCTION","New / change of wafer substrate or carrier material"]
[null,null,"OEC-LAS-PW-02","PROCESS - WAFER PRODUCTION","Wafer diameter"]
[null,null,"OEC-LAS-PW-03","PROCESS - WAFER PRODUCTION","New final wafer thickness"]
[null,null,"OEC-LAS-PW-04","PROCESS - WAFER PRODUCTION","Change of electrically active doping/implantation element"]
[null,null,"OEC-LAS-PW-05","PROCESS - WAFER PRODUCTION","Change of stacking"]
[null,null,"OEC-LAS-PW-06","PROCESS - WAFER PRODUCTION","New / change of metallization (specifically chip frontside)"]
[null,null,"OEC-LAS-PW-07","PROCESS - WAFER PRODUCTION","New / change of metallization (specifically chip backside)"]
[null,null,"OEC-LAS-PW-08","PROCESS - WAFER PRODUCTION","Change in process technique (e.g. significant process changes like lithography, etch, oxide deposition, die back surface preparation/backgrind, ...)"]
[null,null,"OEC-LAS-PW-09","PROCESS - WAFER PRODUCTION","Process Integrity: Tuning within specification"]
[null,null,"OEC-LAS-PW-10","PROCESS - WAFER PRODUCTION","Change of material supplier with no impact on agreed specifications"]
[null,null,"OEC-LAS-PW-11","PROCESS - WAFER PRODUCTION","Change of specified wafer process sequence (deletion and/or additional process step)"]
[null,null,"OEC-LAS-PW-12","PROCESS - WAFER PRODUCTION","New / change of facet passivation"]
[null,null,"OEC-LAS-PW-13","PROCESS - WAFER PRODUCTION","Change in die coating or passivation"]
[null,null,"OEC-LAS-PW-14","PROCESS - WAFER PRODUCTION","New wafer production location or transfer of wafer production to a different not previously released location/site/subcontractor "]
[null,null,"OEC-LAS-BD-01","BARE DIE DELIVERIES ","New / change of front side metallization"]
[null,null,"OEC-LAS-BD-02","BARE DIE DELIVERIES ","New / change of backside metallization"]
[null,null,"OEC-LAS-BD-03","BARE DIE DELIVERIES ","Change of wafer setup or number of dies on wafer."]
[null,null,"OEC-LAS-BD-04","BARE DIE DELIVERIES ","New final wafer thickness"]
[null,null,"OEC-LAS-BD-05","BARE DIE DELIVERIES ","Change in die coating or passivation"]
[null,null,"OEC-LAS-PA-01","PROCESS - ASSEMBLY","Change of leadframe/submount base material"]
[null,null,"OEC-LAS-PA-02","PROCESS - ASSEMBLY","Change of leadframe/submount finishing material (internal)"]
[null,null,"OEC-LAS-PA-03","PROCESS - ASSEMBLY","Change of lead and heat slug plating material/plating thickness (external)"]
[null,null,"OEC-LAS-PA-04","PROCESS - ASSEMBLY","Bump Material / Metal System (internal)"]
[null,null,"OEC-LAS-PA-05","PROCESS - ASSEMBLY","Die attach material"]
[null,null,"OEC-LAS-PA-06","PROCESS - ASSEMBLY","Change of wire bonding\n"]
[null,null,"OEC-LAS-PA-07","PROCESS - ASSEMBLY","Change in material for sub-components (excluding Laser chip & Laser package related items) with impact on agreed specifications"]
[null,null,"OEC-LAS-PA-08","PROCESS - ASSEMBLY","Die Overcoat / Underfill"]
[null,null,"OEC-LAS-PA-09","PROCESS - ASSEMBLY","Change of mold compound/encapsulation/sealing material"]
[null,null,"OEC-LAS-PA-10","PROCESS - ASSEMBLY","Change of conversion material"]
[null,null,"OEC-LAS-PA-11","PROCESS - ASSEMBLY","Change of direct supplier for converter material"]
[null,null,"OEC-LAS-PA-12","PROCESS - ASSEMBLY","Change of converter process technology"]
[null,null,"OEC-LAS-PA-13","PROCESS - ASSEMBLY","Change of assembly of additional internal components (e.g. lenses)"]
[null,null,"OEC-LAS-PA-14","PROCESS - ASSEMBLY","Change of material and / or supplier of additional internal components "]
[null,null,"OEC-LAS-PA-15","PROCESS - ASSEMBLY","Generation of hermeticity"]
[null,null,"OEC-LAS-PA-16","PROCESS - ASSEMBLY","Change of product marking"]
[null,null,"OEC-LAS-PA-17","PROCESS - ASSEMBLY","Change in process technique (e.g., die attach, molding, plating, trim and form, …)"]
[null,null,"OEC-LAS-PA-18","PROCESS - ASSEMBLY","Process Integrity: Tuning within specification"]
[null,null,"OEC-LAS-PA-19","PROCESS - ASSEMBLY","Change of direct material supplier with no impact on specification"]
[null,null,"OEC-LAS-PA-20","PROCESS - ASSEMBLY","Change of specified assembly process sequence (additional and/or deletion of process step)"]
[null,null,"OEC-LAS-PA-21","PROCESS - ASSEMBLY","New assembly location or transfer of assembly to a different not previously released location/site/subcontractor "]
[null,null,"OEC-LAS-PS-01","PACKING/SHIPPING","Outer Packing/shipping specification change"]
[null,null,"OEC-LAS-PS-02","PACKING/SHIPPING","Dry pack requirement change"]
[null,null,"OEC-LAS-PS-03","PACKING/SHIPPING","Inner Packing/shipping specification change"]
[null,null,"OEC-LAS-PS-04","PACKING/SHIPPING","Change of labelling"]
[null,null,"OEC-LAS-EQ-01","EQUIPMENT","Production from a new equipment/tool which uses a different basic technology "]
[null,null,"OEC-LAS-EQ-02","EQUIPMENT","Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool) without change of process."]
[null,null,"OEC-LAS-EQ-03","EQUIPMENT","Change in final test equipment type that uses a different technology"]
[null,null,"OEC-LAS-TF-01","TEST FLOW","Move of all or part of electrical wafer test and/or final test to a different location/site/subcontractor"]
[null,null,"OEC-LAS-QG-01","Q-GATE","Change of the test coverage/testing process flow used by the supplier to ensure data sheet compliance (e.g. elimination/addition of electrical measurement/test flow block; relaxation/enhancement of monitoring procedure or sampling)"]

{"sheet":"5","index":8,"n_rows":54,"n_cols":5,"rows_kept":54,"cut":false,"hidden":true,"merged":[]}
[]
[null,null,"ID","Type","Remarks"]
[null,null,"OEC-PD-AN-01","ANY","Any change with impact on agreed upon technical contractual agreements"]
[null,null,"OEC-PD-AN-02","ANY","Any change with impact on technical interface or processability/manufacturabiliy of customer, which is not covered in the matrix below"]
[null,null,"OEC-PD-DS-01","DATA SHEET","Change of datasheet parameters/electrical specification (min./max./typ. values) and/or Pulse/DC specification "]
[null,null,"OEC-PD-DS-02","DATA SHEET","Correction of data sheet or issue of errata"]
[null,null,"OEC-PD-DS-03","DATA SHEET","Specification of additional parameters "]
[null,null,"OEC-PD-DE-01","DESIGN","Design changes in epitaxy."]
[null,null,"OEC-PD-DE-02","DESIGN","Design changes in routing/layout."]
[null,null,"OEC-PD-DE-03","DESIGN","Die shrink "]
[null,null,"OEC-PD-DE-04","DESIGN","PD package (except leadframe)"]
[null,null,"OEC-PD-DE-05","DESIGN","Design of leadframe "]
[null,null,"OEC-PD-PW-01","PROCESS - WAFER PRODUCTION","New / change of wafer substrate or carrier material"]
[null,null,"OEC-PD-PW-02","PROCESS - WAFER PRODUCTION","Wafer diameter"]
[null,null,"OEC-PD-PW-03","PROCESS - WAFER PRODUCTION","New final wafer thickness"]
[null,null,"OEC-PD-PW-04","PROCESS - WAFER PRODUCTION","Change of electrically active doping/implantation element"]
[null,null,"OEC-PD-PW-05","PROCESS - WAFER PRODUCTION","Change of stacking"]
[null,null,"OEC-PD-PW-06","PROCESS - WAFER PRODUCTION","New / change of metallization (specifically chip frontside)"]
[null,null,"OEC-PD-PW-07","PROCESS - WAFER PRODUCTION","New / change of metallization (specifically chip backside)"]
[null,null,"OEC-PD-PW-08","PROCESS - WAFER PRODUCTION","Change in process technique (e.g. significant process changes like lithography, etch, oxide deposition, die back surface preparation/backgrind, ...)"]
[null,null,"OEC-PD-PW-09","PROCESS - WAFER PRODUCTION","Process Integrity: Tuning within specification"]
[null,null,"OEC-PD-PW-10","PROCESS - WAFER PRODUCTION","Change of material supplier with no impact on agreed specifications"]
[null,null,"OEC-PD-PW-11","PROCESS - WAFER PRODUCTION","Change of specified wafer process sequence (deletion and/or additional process step)"]
[null,null,"OEC-PD-PW-12","PROCESS - WAFER PRODUCTION","Change in die coating or passivation"]
[null,null,"OEC-PD-PW-13","PROCESS - WAFER PRODUCTION","New wafer production location or transfer of wafer production to a different not previously released location/site/subcontractor "]
[null,null,"OEC-PD-BD-01","BARE DIE DELIVERIES","New / change of front side metallization"]
[null,null,"OEC-PD-BD-02","BARE DIE DELIVERIES","New / change of backside metallization"]
[null,null,"OEC-PD-BD-03","BARE DIE DELIVERIES","Change of wafer setup or number of dies on wafer."]
[null,null,"OEC-PD-BD-04","BARE DIE DELIVERIES","New final wafer thickness"]
[null,null,"OEC-PD-BD-05","BARE DIE DELIVERIES","Change in die coating or passivation"]
[null,null,"OEC-PD-PA-01","PROCESS - ASSEMBLY","Change of leadframe/submount base material"]
[null,null,"OEC-PD-PA-02","PROCESS - ASSEMBLY","Change of leadframe/submount finishing material (internal)"]
[null,null,"OEC-PD-PA-03","PROCESS - ASSEMBLY","Change of lead and heat slug plating material/plating thickness (external)"]
[null,null,"OEC-PD-PA-04","PROCESS - ASSEMBLY","Bump Material / Metal System (internal)"]
[null,null,"OEC-PD-PA-05","PROCESS - ASSEMBLY","Die attach material"]
[null,null,"OEC-PD-PA-06","PROCESS - ASSEMBLY","Change of wire bonding"]
[null,null,"OEC-PD-PA-07 ","PROCESS - ASSEMBLY","Change in material for subcomponents (excluding\nphotodiode/transistor chip & package related items) with impact on agreed specifications"]
[null,null,"OEC-PD-PA-08","PROCESS - ASSEMBLY","Die Overcoat / Underfill "]
[null,null,"OEC-PD-PA-09","PROCESS - ASSEMBLY","Change of mold compound/encapsulation/sealing material"]
[null,null,"OEC-PD-PA-10","PROCESS - ASSEMBLY","Change of product marking"]
[null,null,"OEC-PD-PA-11","PROCESS - ASSEMBLY","Change in process technique (e.g., die attach, molding, plating, trim and form, …)"]
[null,null,"OEC-PD-PA-12","PROCESS - ASSEMBLY","Process Integrity: Tuning within specification"]
[null,null,"OEC-PD-PA-13","PROCESS - ASSEMBLY","Change of direct material supplier with no impact on specification"]
[null,null,"OEC-PD-PA-14","PROCESS - ASSEMBLY","Change of specified assembly process sequence (additional and/or deletion of process step)"]
[null,null,"OEC-PD-PA-15","PROCESS - ASSEMBLY","New assembly location or transfer of assembly to a different not previously released location/site/subcontractor "]
[null,null,"OEC-PD-PS-01","PACKING/SHIPPING","Outer Packing/shipping specification change"]
[null,null,"OEC-PD-PS-02","PACKING/SHIPPING","Dry pack requirement change"]
[null,null,"OEC-PD-PS-03","PACKING/SHIPPING","Inner Packing/shipping specification change"]
[null,null,"OEC-PD-PS-04","PACKING/SHIPPING","Change of labelling"]
[null,null,"OEC-PD-EQ-01","EQUIPMENT","Production from a new equipment/tool which uses a different basic technology "]
[null,null,"OEC-PD-EQ-02","EQUIPMENT","Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool) without change of process."]
[null,null,"OEC-PD-EQ-03","EQUIPMENT","Change in final test equipment type that uses a different technology"]
[null,null,"OEC-PD-TF-01","TEST FLOW","Move of all or part of electrical wafer test and/or final test to a different location/site/subcontractor"]
[null,null,"OEC-PD-QG-01","Q-GATE","Change of the test coverage/testing process flow used by the supplier to ensure data sheet compliance (e.g. elimination/addition of electrical measurement/test flow block; relaxation/enhancement of monitoring procedure or sampling)"]

{"sheet":"6","index":9,"n_rows":30,"n_cols":5,"rows_kept":30,"cut":false,"hidden":true,"merged":[]}
[]
[null,null,"ID","Type","Remarks"]
[null,null,"MCM-AN-01","ANY","Any change with impact on agreed upon technical contractual agreements"]
[null,null,"MCM-AN-02","ANY","Any change with impact on processability/manufacturability at customer, which is not covered in the matrix below."]
[null,null,"MCM-DS-01","DATA SHEET","Change of datasheet parameters/electrical specification (min./max./typ. values) and/or AC/DC specification"]
[null,null,"MCM-DS-02","DATA SHEET","Correction of data sheet / errata"]
[null,null,"MCM-DS-03","DATA SHEET","Specification of additional parameters"]
[null,null,"MCM-DE-01","DESIGN","Firmware modification"]
[null,null,"MCM-DE-02","DESIGN","Change that adds or subtracts sub-components from the module BOM"]
[null,null,"MCM-DE-03","DESIGN","Substrate change affecting module schematic\n(Changes to the internal dimensions and / or schematics)"]
[null,null,"MCM-PA-01","PROCESS - ASSEMBLY - MATERIALS","Replacement of any sub-component by a Non-AEC qualified sub-component"]
[null,null,"MCM-PA-02","PROCESS - ASSEMBLY - MATERIALS","\nReplacement of any sub-component by an AEC qualified sub-component "]
[null,null,"MCM-PA-03","PROCESS - ASSEMBLY - MATERIALS","Replacement of any sub-component by an AEC qualified sub-component \nCritical characteristics of sub-component are not affected"]
[null,null,"MCM-PA-04","PROCESS - ASSEMBLY - MATERIALS","Change within a sub-component that has been requalified\nCritical characteristics of sub-component are affected"]
[null,null,"MCM-PA-05","PROCESS - ASSEMBLY - MATERIALS","Change within a sub-component that has been requalified\nCritical characteristics of sub-component are not affected"]
[null,null,"MCM-PA-07","PROCESS - ASSEMBLY - MATERIALS","Change to the processes used in module assembly (e.g., pick & place, die attach, bonding, reflow, encapsulation, singulation, die overcoat, underfill, die preparation, die clean)"]
[null,null,"MCM-PA-08","PROCESS - ASSEMBLY - MATERIALS","Process integrity: tuning within specification"]
[null,null,"MCM-PA-09","PROCESS - ASSEMBLY - MATERIALS","Change to materials used in module assembly (e.g., adhesive, underfill, encapsulate, solder, epoxy, bump material, die attach material, bond wire, die overcoat, substrate, leadframe base material)"]
[null,null,"MCM-PA-10","PROCESS - ASSEMBLY - MATERIALS","Change of direct material supplier"]
[null,null,"MCM-PA-11","PROCESS - ASSEMBLY - MATERIALS","Change to assembly location\n(Move all or parts of production to a different assembly site)"]
[null,null,"MCM-PA-12","PROCESS - ASSEMBLY - MATERIALS","Change of product marking"]
[null,null,"MCM-PS-01","PACKING/SHIPPING","Packing/shipping specification change"]
[null,null,"MCM-PS-02","PACKING/SHIPPING","Dry pack requirements change "]
[null,null,"MCM-PS-03","PACKING/SHIPPING","Change of carrier (tray, reel)"]
[null,null,"MCM-PS-04","PACKING/SHIPPING","Change of labelling"]
[null,null,"MCM-EQ-01","EQUIPMENT","Production from a new equipment/tool which uses a different basic technology or which due to its unique form or function can be expected to influence the integrity of the final product"]
[null,null,"MCM-EQ-02","EQUIPMENT","Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool) without change of process."]
[null,null,"MCM-EQ-03","EQUIPMENT","Change to testing platform\n(Change in final test equipment type leading to a different test concept) "]
[null,null,"MCM-TF-01","TEST FLOW","Change to testing location\n(Move of all or part of the final test to a different test site)"]
[null,null,"MCM-QG-01","Q-GATE","Change of the test coverage/testing process flow used by the supplier to ensure data sheet compliance (e.g. elimination/addition of electrical measurement/test flow block; relaxation/enhancement of monitoring procedure or sampling)"]

{"sheet":"7","index":10,"n_rows":35,"n_cols":5,"rows_kept":35,"cut":false,"hidden":true,"merged":[]}
[]
[null,null,"ID","Type","Remarks"]
[null,null,"PAS-RES-AN-01","ANY","Any change with impact on agreed upon technical contractual agreements"]
[null,null,"PAS-RES-AN-02","ANY","Any change with impact on processability/manufacturabiliy at customer, which is not covered in the matrix below."]
[null,null,"PAS-RES-DS-01","DATA SHEET","Change of datasheet parameters/electrical specification (min./max./typ. values) and / or AC/DC specification"]
[null,null,"PAS-RES-DS-02","DATA SHEET","Correction of data sheet or issue of errata"]
[null,null,"PAS-RES-DS-03","DATA SHEET","Specification of additional parameters"]
[null,null,"PAS-RES-MA-01","MATERIAL","Change of material composition - Ink/Wire material of Resistor element"]
[null,null,"PAS-RES-MA-02","MATERIAL","Change of material composition - Ink/Wire material of Terminal element"]
[null,null,"PAS-RES-MA-03","MATERIAL","Change of material composition - Package/ Mold"]
[null,null,"PAS-RES-MA-04","MATERIAL","Change of material composition - Passivation"]
[null,null,"PAS-RES-MA-05","MATERIAL","Change of material composition - Substrate material"]
[null,null,"PAS-RES-MA-06","MATERIAL","Change of supplier of material"]
[null,null,"PAS-RES-DE-01","DESIGN","Changes of termination, surface finish, shape, color, appearance or dimension structure"]
[null,null,"PAS-RES-DE-02","DESIGN","Changes of inner construction - Passivation"]
[null,null,"PAS-RES-PR-01","PROCESS","Changes in process technology or manufacturing methods - Ink Fire"]
[null,null,"PAS-RES-PR-02","PROCESS","Changes in process technology or manufacturing methods - Ink Print"]
[null,null,"PAS-RES-PR-03","PROCESS","Changes in process technology or manufacturing methods - Trim"]
[null,null,"PAS-RES-PR-04","PROCESS","Changes in process technology or manufacturing methods - Lead Form"]
[null,null,"PAS-RES-PR-05","PROCESS","Changes in process technology or manufacturing methods - Termination Attach"]
[null,null,"PAS-RES-PR-06","PROCESS","Changes in process technology or manufacturing methods - Marking"]
[null,null,"PAS-RES-PR-07","PROCESS","Changes in process technology or manufacturing methods - Molding"]
[null,null,"PAS-RES-PR-08","PROCESS","Process integrity: tuning within specification"]
[null,null,"PAS-RES-PN-01","PACKING / SHIPPING  -  NEW MATERIAL, CRITICAL DIMENSIONS","Packing / shipping specification change (loosening of tolerances)"]
[null,null,"PAS-RES-PN-02","PACKING / SHIPPING  -  NEW MATERIAL, CRITICAL DIMENSIONS","Dry pack requirements change"]
[null,null,"PAS-RES-PN-03","PACKING / SHIPPING  -  NEW MATERIAL, CRITICAL DIMENSIONS","Change of carrier (tray, reel)"]
[null,null,"PAS-RES-PV-01","PACKING / SHIPPING  -  VISUAL INSPECTION","Change of labelling"]
[null,null,"PAS-RES-PV-02","PACKING / SHIPPING  -  VISUAL INSPECTION","Change of product marking"]
[null,null,"PAS-RES-PV-03","PACKING / SHIPPING  -  VISUAL INSPECTION","Change of packing/shipping specification"]
[null,null,"PAS-RES-EQ-01","LOGISTICS / CAPACITY / TESTING  -  EQUIPMEMENT","Production from a new equipment/tool which uses a different technology or which due to its unique form or function can be expected to influence the integrity of the final product"]
[null,null,"PAS-RES-EQ-02","LOGISTICS / CAPACITY / TESTING  -  EQUIPMEMENT","Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool)"]
[null,null,"PAS-RES-EQ-03","LOGISTICS / CAPACITY / TESTING  -  EQUIPMEMENT","Change in final test equipment type that uses a different technology"]
[null,null,"PAS-RES-PF-01","LOGISTICS / CAPACITY / TESTING  -  PROCESS FLOW","Manufacturing site transfer or movement of a part of production process to a different location/site"]
[null,null,"PAS-RES-PF-02","LOGISTICS / CAPACITY / TESTING  -  PROCESS FLOW","Elimination or addition of a manufacturing process step"]
[null,null,"PAS-RES-QG-01","LOGISTICS / CAPACITY / TESTING  -  Q-GATE","Change of test coverage used by the supplier to ensure data sheet compliance (e.g., elimination/addition of electrical measurement/test flow block, relaxation/enhancement of monitoring procedure or sampling)"]

{"sheet":"8","index":11,"n_rows":47,"n_cols":5,"rows_kept":47,"cut":false,"hidden":true,"merged":[]}
[]
[null,null,"ID","Type","Remarks"]
[null,null,"PAS-IND-AN-01","ANY","Any change with impact on agreed upon technical contractual agreements"]
[null,null,"PAS-IND-AN-02","ANY","Any change with impact on processability/manufacturabiliy at customer, which is not covered in the matrix below."]
[null,null,"PAS-IND-DS-01","DATA SHEET","Change of datasheet parameters/electrical specification (min./max./typ. values) and / or AC/DC specification"]
[null,null,"PAS-IND-DS-02","DATA SHEET","Correction of data sheet or issue of errata"]
[null,null,"PAS-IND-DS-03","DATA SHEET","Specification of additional parameters"]
[null,null,"PAS-IND-MA-01","MATERIAL","Change of material composition - Bobbin Material"]
[null,null,"PAS-IND-MA-02","MATERIAL","Change of material composition - Core Material"]
[null,null,"PAS-IND-MA-03","MATERIAL","Change of material composition - Insulation Material"]
[null,null,"PAS-IND-MA-04","MATERIAL","Change of material composition - Lead Material"]
[null,null,"PAS-IND-MA-05","MATERIAL","Change of material composition - Mold Compound"]
[null,null,"PAS-IND-MA-06","MATERIAL","Change of material composition - Solder Material"]
[null,null,"PAS-IND-MA-07","MATERIAL","Change of material composition - Wire / Foil Material"]
[null,null,"PAS-IND-MA-08","MATERIAL","Change of material composition - Glue"]
[null,null,"PAS-IND-MA-09","MATERIAL","Change of supplier of material"]
[null,null,"PAS-IND-MA-10","MATERIAL","Change of material composition - Potting Material"]
[null,null,"PAS-IND-DE-01","DESIGN","Changes of termination, surface finish, shape, color, appearance or dimension structure - Bobbin"]
[null,null,"PAS-IND-DE-02","DESIGN","Changes of termination, surface finish, shape, color, appearance or dimension structure - Lead/Terminals"]
[null,null,"PAS-IND-DE-03","DESIGN","Changes of termination, surface finish, shape, color, appearance or dimension structure - Mold"]
[null,null,"PAS-IND-DE-04","DESIGN","Changes of inner construction - Core Construction"]
[null,null,"PAS-IND-DE-05","DESIGN","Changes of inner construction - Insulation System"]
[null,null,"PAS-IND-DE-06","DESIGN","Changes of inner construction - Wire / Foil Construction"]
[null,null,"PAS-IND-DE-07","DESIGN","Changes of termination, surface finish, shape, color, appearance or dimension structure - Potting Material"]
[null,null,"PAS-IND-PR-01","PROCESS","Changes in process technology or manufacturing methods - Insulation Strip"]
[null,null,"PAS-IND-PR-02","PROCESS","Changes in process technology or manufacturing methods - Lead Prep. / Plating"]
[null,null,"PAS-IND-PR-03","PROCESS","Changes in process technology or manufacturing methods - Terminal Attach"]
[null,null,"PAS-IND-PR-04","PROCESS","Changes in process technology or manufacturing methods - Marking"]
[null,null,"PAS-IND-PR-05","PROCESS","Changes in process technology or manufacturing methods - Molding"]
[null,null,"PAS-IND-PR-06","PROCESS","Changes in process technology or manufacturing methods - Soldering Internal Connections"]
[null,null,"PAS-IND-PR-07","PROCESS","Changes in process technology or manufacturing methods - Winding Insulation"]
[null,null,"PAS-IND-PR-08","PROCESS","Changes in process technology or manufacturing methods - Winding Wire"]
[null,null,"PAS-IND-PR-09","PROCESS","Process integrity: tuning within specification"]
[null,null,"PAS-IND-PR-10","PROCESS","Changes in process technology or manufacturing methods - Potting"]
[null,null,"PAS-IND-PN-01","PACKING / SHIPPING  -  NEW MATERIAL, CRITICAL DIMENSIONS","Packing / shipping specification change (loosening of tolerances)"]
[null,null,"PAS-IND-PN-02","PACKING / SHIPPING  -  NEW MATERIAL, CRITICAL DIMENSIONS","Dry pack requirements change"]
[null,null,"PAS-IND-PN-03","PACKING / SHIPPING  -  NEW MATERIAL, CRITICAL DIMENSIONS","Change of carrier (tray, reel)"]
[null,null,"PAS-IND-PV-01","PACKING / SHIPPING  -  VISUAL INSPECTION","Change of labelling"]
[null,null,"PAS-IND-PV-02","PACKING / SHIPPING  -  VISUAL INSPECTION","Change of product marking"]
[null,null,"PAS-IND-PV-03","PACKING / SHIPPING  -  VISUAL INSPECTION","Change of packing/shipping specification"]
[null,null,"PAS-IND-EQ-01","LOGISTICS / CAPACITY / TESTING  -  EQUIPMEMENT","Production from a new equipment/tool which uses a different technology or which due to its unique form or function can be expected to influence the integrity of the final product"]
[null,null,"PAS-IND-EQ-02","LOGISTICS / CAPACITY / TESTING  -  EQUIPMEMENT","Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool)"]
[null,null,"PAS-IND-EQ-03","LOGISTICS / CAPACITY / TESTING  -  EQUIPMEMENT","Change in final test equipment type that uses a different technology"]
[null,null,"PAS-IND-PF-01","LOGISTICS / CAPACITY / TESTING  -  PROCESS FLOW","Manufacturing site transfer or movement of a part of production process to a different location/site"]
[null,null,"PAS-IND-PF-02","LOGISTICS / CAPACITY / TESTING  -  PROCESS FLOW","Elimination or addition of a manufacturing process step"]
[null,null,"PAS-IND-PF-03","LOGISTICS / CAPACITY / TESTING  -  PROCESS FLOW","Elimination of final electrical measurement / test flow block"]
[null,null,"PAS-IND-QG-01","LOGISTICS / CAPACITY / TESTING  -  Q-GATE","Change of test coverage used by the supplier to ensure data sheet compliance (e.g., elimination/addition of electrical measurement/test flow block, relaxation/enhancement of monitoring procedure or sampling)"]

{"sheet":"9","index":12,"n_rows":41,"n_cols":5,"rows_kept":41,"cut":false,"hidden":true,"merged":[]}
[]
[null,null,"ID","Type","Remarks"]
[null,null,"PAS-CER-AN-01","ANY","Any change with impact on agreed upon technical contractual agreements"]
[null,null,"PAS-CER-AN-02","ANY","Any change with impact on processability/manufacturabiliy at customer, which is not covered in the matrix below."]
[null,null,"PAS-CER-DS-01","DATA SHEET","Change of datasheet parameters/electrical specification (min./max./typ. values) and / or AC/DC specification"]
[null,null,"PAS-CER-DS-02","DATA SHEET","Correction of data sheet or issue of errata"]
[null,null,"PAS-CER-DS-03","DATA SHEET","Specification of additional parameters"]
[null,null,"PAS-CER-MA-01","MATERIAL","Change of material composition - Ceramic Binder"]
[null,null,"PAS-CER-MA-02","MATERIAL","Change of material composition - Tantalum Binder"]
[null,null,"PAS-CER-MA-03","MATERIAL","Change of material composition - Dielectric"]
[null,null,"PAS-CER-MA-04","MATERIAL","Change of material composition - Electrode Attach"]
[null,null,"PAS-CER-MA-05","MATERIAL","Change of material composition - Electrode Material"]
[null,null,"PAS-CER-MA-06","MATERIAL","Change of material composition - Encapsulation"]
[null,null,"PAS-CER-MA-07","MATERIAL","Change of material composition - Lead material / Termination"]
[null,null,"PAS-CER-MA-08","MATERIAL","Change of supplier of material"]
[null,null,"PAS-CER-DE-01","DESIGN","Changes of termination, surface finish, shape, color, appearance or dimension structure - Lead Diameter"]
[null,null,"PAS-CER-DE-02","DESIGN","Changes of termination, surface finish, shape, color, appearance or dimension structure - Termination Area"]
[null,null,"PAS-CER-DE-03","DESIGN","Changes of termination, surface finish, shape, color, appearance or dimension structure - Terminal Interface"]
[null,null,"PAS-CER-DE-04","DESIGN","Changes of inner construction - Electrode Thickness"]
[null,null,"PAS-CER-DE-05","DESIGN","Changes of inner construction - Layer Thickness"]
[null,null,"PAS-CER-DE-06","DESIGN","Changes of inner construction - Number of Layers"]
[null,null,"PAS-CER-PR-01","PROCESS","Changes in process technology or manufacturing methods - Dicing"]
[null,null,"PAS-CER-PR-02","PROCESS","Changes in process technology or manufacturing methods - Electrode apply"]
[null,null,"PAS-CER-PR-03","PROCESS","Changes in process technology or manufacturing methods - Firing"]
[null,null,"PAS-CER-PR-04","PROCESS","Changes in process technology or manufacturing methods - Lamination"]
[null,null,"PAS-CER-PR-05","PROCESS","Changes in process technology or manufacturing methods - Particle Size"]
[null,null,"PAS-CER-PR-06","PROCESS","Changes in process technology or manufacturing methods - Screening/Printing"]
[null,null,"PAS-CER-PR-07","PROCESS","Changes in process technology or manufacturing methods - Termination"]
[null,null,"PAS-CER-PR-08","PROCESS","Process integrity: tuning within specification"]
[null,null,"PAS-CER-PN-01","PACKING / SHIPPING  -  NEW MATERIAL, CRITICAL DIMENSIONS","Packing / shipping specification change (loosening of tolerances)"]
[null,null,"PAS-CER-PN-02","PACKING / SHIPPING  -  NEW MATERIAL, CRITICAL DIMENSIONS","Dry pack requirements change"]
[null,null,"PAS-CER-PN-03","PACKING / SHIPPING  -  NEW MATERIAL, CRITICAL DIMENSIONS","Change of carrier (tray, reel)"]
[null,null,"PAS-CER-PV-01","PACKING / SHIPPING  -  VISUAL INSPECTION","Change of labelling"]
[null,null,"PAS-CER-PV-02","PACKING / SHIPPING  -  VISUAL INSPECTION","Change of product marking"]
[null,null,"PAS-CER-PV-03","PACKING / SHIPPING  -  VISUAL INSPECTION","Change of packing/shipping specification"]
[null,null,"PAS-CER-EQ-01","LOGISTICS / CAPACITY / TESTING  -  EQUIPMEMENT","Production from a new equipment/tool which uses a different technology or which due to its unique form or function can be expected to influence the integrity of the final product"]
[null,null,"PAS-CER-EQ-02","LOGISTICS / CAPACITY / TESTING  -  EQUIPMEMENT","Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool)"]
[null,null,"PAS-CER-EQ-03","LOGISTICS / CAPACITY / TESTING  -  EQUIPMEMENT","Change in final test equipment type that uses a different technology"]
[null,null,"PAS-CER-PF-01","LOGISTICS / CAPACITY / TESTING  -  PROCESS FLOW","Manufacturing site transfer or movement of a part of production process to a different location/site"]
[null,null,"PAS-CER-PF-02","LOGISTICS / CAPACITY / TESTING  -  PROCESS FLOW","Elimination or addition of a manufacturing process step"]
[null,null,"PAS-CER-QG-01","LOGISTICS / CAPACITY / TESTING  -  Q-GATE","Change of test coverage used by the supplier to ensure data sheet compliance (e.g., elimination/addition of electrical measurement/test flow block, relaxation/enhancement of monitoring procedure or sampling)"]

{"sheet":"10","index":13,"n_rows":37,"n_cols":5,"rows_kept":37,"cut":false,"hidden":true,"merged":[]}
[]
[null,null,"ID","Type","Remarks"]
[null,null,"PAS-FLM-AN-01","Any","Any change with impact on agreed upon technical contractual agreements"]
[null,null,"PAS-FLM-AN-02","Any","Any change with impact on processability/manufacturabiliy at customer, which is not covered in the matrix below."]
[null,null,"PAS-FLM-DS-01","DATA SHEET","Change of datasheet parameters/electrical specification (min./max./typ. values) and / or AC/DC specification"]
[null,null,"PAS-FLM-DS-02","DATA SHEET","Correction of data sheet or issue of errata"]
[null,null,"PAS-FLM-DS-03","DATA SHEET","Specification of additional parameters"]
[null,null,"PAS-FLM-MA-01","MATERIAL","Change of material composition - Sealing Compound"]
[null,null,"PAS-FLM-MA-02","MATERIAL","Change of material composition - Package "]
[null,null,"PAS-FLM-MA-03","MATERIAL","Change of material composition - Lead/Termination"]
[null,null,"PAS-FLM-MA-04","MATERIAL","Change of material composition - Metal Spray (Schoop)"]
[null,null,"PAS-FLM-MA-05","MATERIAL","Change of material composition - Film"]
[null,null,"PAS-FLM-MA-06","MATERIAL","Change of material composition - Metal Foil"]
[null,null,"PAS-FLM-MA-07","MATERIAL","Change of supplier of material"]
[null,null,"PAS-FLM-DE-01","DESIGN","Changes of termination, surface finish, shape, color, appearance or dimension structure - Lead Diameter / Thickness"]
[null,null,"PAS-FLM-DE-02","DESIGN","Changes of termination, surface finish, shape, color, appearance or dimension structure - Termination Area"]
[null,null,"PAS-FLM-DE-03","DESIGN","Changes of inner construction - Inner Connection"]
[null,null,"PAS-FLM-DE-04","DESIGN","Changes of termination, surface finish, shape, color, appearance or dimension structure - Appearance"]
[null,null,"PAS-FLM-DE-05","DESIGN","Changes of inner construction - Film/Foil"]
[null,null,"PAS-FLM-DE-06","DESIGN","Changes of inner construction - Insulation System"]
[null,null,"PAS-FLM-DE-07","DESIGN","Changes of termination, surface finish, shape, color, appearance or dimension structure - Package"]
[null,null,"PAS-FLM-PR-01","PROCESS","Changes in process technology or manufacturing methods - Package"]
[null,null,"PAS-FLM-PR-02","PROCESS","Changes in process technology or manufacturing methods - Terminal Attach"]
[null,null,"PAS-FLM-PR-03","PROCESS","Changes in process technology or manufacturing methods - Winding"]
[null,null,"PAS-FLM-PR-04","PROCESS","Process integrity: tuning within specification"]
[null,null,"PAS-FLM-PN-01","PACKING / SHIPPING  -  NEW MATERIAL, CRITICAL DIMENSIONS","Packing / shipping specification change (loosening of tolerances)"]
[null,null,"PAS-FLM-PN-02","PACKING / SHIPPING  -  NEW MATERIAL, CRITICAL DIMENSIONS","Dry pack requirements change"]
[null,null,"PAS-FLM-PN-03","PACKING / SHIPPING  -  NEW MATERIAL, CRITICAL DIMENSIONS","Change of carrier (tray, reel)"]
[null,null,"PAS-FLM-PV-01","PACKING / SHIPPING  -  VISUAL INSPECTION","Change of labelling"]
[null,null,"PAS-FLM-PV-02","PACKING / SHIPPING  -  VISUAL INSPECTION","Change of product marking"]
[null,null,"PAS-FLM-PV-03","PACKING / SHIPPING  -  VISUAL INSPECTION","Change of packing/shipping specification"]
[null,null,"PAS-FLM-EQ-01","LOGISTICS / CAPACITY / TESTING  -  EQUIPEMEMENT","Production from a new equipment/tool which uses a different technology or which due to its unique form or function can be expected to influence the integrity of the final product"]
[null,null,"PAS-FLM-EQ-02","LOGISTICS / CAPACITY / TESTING  -  EQUIPEMEMENT","Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool)"]
[null,null,"PAS-FLM-EQ-03","LOGISTICS / CAPACITY / TESTING  -  EQUIPEMEMENT","Change in final test equipment type that uses a different technology"]
[null,null,"PAS-FLM-PF-01","LOGISTICS / CAPACITY / TESTING  -  PROCESS FLOW","Manufacturing site transfer or movement of a part of production process to a different location/site"]
[null,null,"PAS-FLM-PF-02","LOGISTICS / CAPACITY / TESTING  -  PROCESS FLOW","Elimination or addition of a manufacturing process step"]
[null,null,"PAS-FLM-QG-02","LOGISTICS / CAPACITY / TESTING  -  Q-GATE","Change of test coverage used by the supplier to ensure data sheet compliance (e.g., elimination/addition of electrical measurement/test flow block, relaxation/enhancement of monitoring procedure or sampling)"]

{"sheet":"11","index":14,"n_rows":48,"n_cols":5,"rows_kept":48,"cut":false,"hidden":true,"merged":[]}
[]
[null,null,"ID","Type","Remarks"]
[null,null,"PAS-QUA-AN-01","ANY","Any change with impact on agreed upon technical contractual agreements"]
[null,null,"PAS-QUA-AN-02","ANY","Any change with impact on processability/manufacturabiliy at customer, which is not covered in the matrix below."]
[null,null,"PAS-QUA-DS-01","DATA SHEET","Change of datasheet parameters/electrical specification (min./max./typ. values) and / or AC/DC specification"]
[null,null,"PAS-QUA-DS-02","DATA SHEET","Correction of data sheet or issue of errata"]
[null,null,"PAS-QUA-DS-03","DATA SHEET","Specification of additional parameters"]
[null,null,"PAS-QUA-MA-01","MATERIAL","Change of material composition - Quartz Blank"]
[null,null,"PAS-QUA-MA-02","MATERIAL","Change of material composition - Base"]
[null,null,"PAS-QUA-MA-03","MATERIAL","Change of material composition - Lead / Termination"]
[null,null,"PAS-QUA-MA-04","MATERIAL","Change of material composition - Sealing"]
[null,null,"PAS-QUA-MA-05","MATERIAL","Change of material composition - Can / Cap"]
[null,null,"PAS-QUA-MA-06","MATERIAL","Change of material composition - Blank Support"]
[null,null,"PAS-QUA-MA-07","MATERIAL","Change of material composition - Overmold"]
[null,null,"PAS-QUA-MA-08","MATERIAL","Change of material composition - Case Sealing"]
[null,null,"PAS-QUA-MA-09","MATERIAL","Change of material composition - Electrode"]
[null,null,"PAS-QUA-MA-10","MATERIAL","Change of material composition - Insulator"]
[null,null,"PAS-QUA-MA-11","MATERIAL","Change of material composition - Marking"]
[null,null,"PAS-QUA-MA-12","MATERIAL","Change of supplier of material"]
[null,null,"PAS-QUA-DE-01","DESIGN","Changes of termination, surface finish, shape, color, appearance or dimension structure - Base"]
[null,null,"PAS-QUA-DE-02","DESIGN","Changes of termination, surface finish, shape, color, appearance or dimension structure - Lead / Termination"]
[null,null,"PAS-QUA-DE-03","DESIGN","Changes of termination, surface finish, shape, color, appearance or dimension structure - Can / Cap"]
[null,null,"PAS-QUA-DE-04","DESIGN","Changes of termination, surface finish, shape, color, appearance or dimension structure - Package"]
[null,null,"PAS-QUA-DE-05","DESIGN","Changes of termination, surface finish, shape, color, appearance or dimension structure - Insulator"]
[null,null,"PAS-QUA-DE-06","DESIGN","Changes of inner construction - Quartz Blank"]
[null,null,"PAS-QUA-DE-07","DESIGN","Changes of inner construction - Blank Support"]
[null,null,"PAS-QUA-PR-01","PROCESS","Changes in process technology or manufacturing methods - Quartz Blank"]
[null,null,"PAS-QUA-PR-02","PROCESS","Changes in process technology or manufacturing methods - Blank Etching / Cleaning"]
[null,null,"PAS-QUA-PR-03","PROCESS","Changes in process technology or manufacturing methods - Electrode Formation"]
[null,null,"PAS-QUA-PR-04","PROCESS","Changes in process technology or manufacturing methods - Trimming"]
[null,null,"PAS-QUA-PR-05","PROCESS","Changes in process technology or manufacturing methods - Bonding / Annealing"]
[null,null,"PAS-QUA-PR-06","PROCESS","Changes in process technology or manufacturing methods - Can / Cap Attaching"]
[null,null,"PAS-QUA-PR-07","PROCESS","Changes in process technology or manufacturing methods - Molding"]
[null,null,"PAS-QUA-PR-08","PROCESS","Changes in process technology or manufacturing methods - Marking"]
[null,null,"PAS-QUA-PR-09","PROCESS","Changes in process technology or manufacturing methods - Aging"]
[null,null,"PAS-QUA-PR-10","PROCESS","Process integrity: tuning within specification"]
[null,null,"PAS-QUA-PN-01","PACKING / SHIPPING  -  NEW MATERIAL, CRITICAL DIMENSIONS","Packing / shipping specification change (loosening of tolerances)"]
[null,null,"PAS-QUA-PN-02","PACKING / SHIPPING  -  NEW MATERIAL, CRITICAL DIMENSIONS","Dry pack requirements change"]
[null,null,"PAS-QUA-PN-03","PACKING / SHIPPING  -  NEW MATERIAL, CRITICAL DIMENSIONS","Change of carrier (tray, reel)"]
[null,null,"PAS-QUA-PV-01","PACKING / SHIPPING  -  VISUAL INSPECTION","Change of labelling"]
[null,null,"PAS-QUA-PV-02","PACKING / SHIPPING  -  VISUAL INSPECTION","Change of product marking"]
[null,null,"PAS-QUA-PV-03","PACKING / SHIPPING  -  VISUAL INSPECTION","Change of packing/shipping specification"]
[null,null,"PAS-QUA-EQ-01","LOGISTICS / CAPACITY / TESTING  -  EQUIPMEMENT","Production from a new equipment/tool which uses a different technology or which due to its unique form or function can be expected to influence the integrity of the final product"]
[null,null,"PAS-QUA-EQ-02","LOGISTICS / CAPACITY / TESTING  -  EQUIPMEMENT","Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool)"]
[null,null,"PAS-QUA-EQ-03","LOGISTICS / CAPACITY / TESTING  -  EQUIPMEMENT","Change in final test equipment type that uses a different technology"]
[null,null,"PAS-QUA-PF-01","LOGISTICS / CAPACITY / TESTING  -  PROCESS FLOW","Manufacturing site transfer or movement of a part of production process to a different location/site"]
[null,null,"PAS-QUA-PF-02","LOGISTICS / CAPACITY / TESTING  -  PROCESS FLOW","Elimination or addition of a manufacturing process step"]
[null,null,"PAS-QUA-QG-01","LOGISTICS / CAPACITY / TESTING  -  Q-GATE","Change of test coverage used by the supplier to ensure data sheet compliance (e.g., elimination/addition of electrical measurement/test flow block, relaxation/enhancement of monitoring procedure or sampling)"]

{"sheet":"12","index":15,"n_rows":47,"n_cols":5,"rows_kept":47,"cut":false,"hidden":true,"merged":[]}
[]
[null,null,"ID","Type","Remarks"]
[null,null,"PAS-ALU-AN-01","Any","Any change with impact on agreed upon technical contractual agreements"]
[null,null,"PAS-ALU-AN-02","Any","Any change with impact on processability/manufacturabiliy at customer, which is not covered in the matrix below."]
[null,null,"PAS-ALU-DS-01","DATA SHEET","Change of datasheet parameters/electrical specification (min./max./typ. values) and / or AC/DC specification"]
[null,null,"PAS-ALU-DS-02","DATA SHEET","Correction of data sheet or issue of errata"]
[null,null,"PAS-ALU-DS-03","DATA SHEET","Specification of additional parameters"]
[null,null,"PAS-ALU-MA-01","MATERIAL","Change of material composition - Housing"]
[null,null,"PAS-ALU-MA-02","MATERIAL","Change of material composition - Sealing"]
[null,null,"PAS-ALU-MA-03","MATERIAL","Change of material composition - External Insulation"]
[null,null,"PAS-ALU-MA-04","MATERIAL","Change of material composition - Lead / Termination"]
[null,null,"PAS-ALU-MA-05","MATERIAL","Change of material composition - Internal Insulation / Paper"]
[null,null,"PAS-ALU-MA-06","MATERIAL","Change of material composition - Electrolyte"]
[null,null,"PAS-ALU-MA-07","MATERIAL","Change of material composition - Tape Material"]
[null,null,"PAS-ALU-MA-08","MATERIAL","Change of material composition - Base Plate"]
[null,null,"PAS-ALU-MA-09","MATERIAL","Change of supplier of material"]
[null,null,"PAS-ALU-DE-01","DESIGN","Changes of termination, surface finish, shape, color, appearance or dimension structure - Wire Diameter"]
[null,null,"PAS-ALU-DE-02","DESIGN","Changes of termination, surface finish, shape, color, appearance or dimension structure - Termination"]
[null,null,"PAS-ALU-DE-03","DESIGN","Changes of termination, surface finish, shape, color, appearance or dimension structure - Appearance"]
[null,null,"PAS-ALU-DE-04","DESIGN","Changes of termination, surface finish, shape, color, appearance or dimension structure - Rubber Sealing"]
[null,null,"PAS-ALU-DE-05","DESIGN","Changes of inner construction - Aluminum Foil"]
[null,null,"PAS-ALU-DE-06","DESIGN","Changes of inner construction - Seperator"]
[null,null,"PAS-ALU-DE-07","DESIGN","Changes of inner construction - Seperator Density"]
[null,null,"PAS-ALU-DE-08","DESIGN","Changes of inner construction - Inner Connection"]
[null,null,"PAS-ALU-DE-09","DESIGN","Changes of inner construction - Closing Tape"]
[null,null,"PAS-ALU-DE-10","DESIGN","Changes of inner construction - Foil"]
[null,null,"PAS-ALU-PR-01","PROCESS","Changes in process technology or manufacturing methods - Terminal Attach"]
[null,null,"PAS-ALU-PR-02","PROCESS","Changes in process technology or manufacturing methods - Winding"]
[null,null,"PAS-ALU-PR-03","PROCESS","Changes in process technology or manufacturing methods - Impregnation"]
[null,null,"PAS-ALU-PR-04","PROCESS","Changes in process technology or manufacturing methods - Assembly"]
[null,null,"PAS-ALU-PR-05","PROCESS","Changes in process technology or manufacturing methods - Aging / Testing"]
[null,null,"PAS-ALU-PR-06","PROCESS","Changes in process technology or manufacturing methods - Trim & Form Leaded"]
[null,null,"PAS-ALU-PR-07","PROCESS","Changes in process technology or manufacturing methods - Trim & Form SMD"]
[null,null,"PAS-ALU-PR-08","PROCESS","Process integrity: tuning within specification"]
[null,null,"PAS-ALU-PN-01","PACKING / SHIPPING  -  NEW MATERIAL, CRITICAL DIMENSIONS","Packing / shipping specification change (loosening of tolerances)"]
[null,null,"PAS-ALU-PN-02","PACKING / SHIPPING  -  NEW MATERIAL, CRITICAL DIMENSIONS","Dry pack requirements change"]
[null,null,"PAS-ALU-PN-03","PACKING / SHIPPING  -  NEW MATERIAL, CRITICAL DIMENSIONS","Change of carrier (tray, reel)"]
[null,null,"PAS-ALU-PV-01","PACKING / SHIPPING  -  VISUAL INSPECTION","Change of labelling"]
[null,null,"PAS-ALU-PV-02","PACKING / SHIPPING  -  VISUAL INSPECTION","Change of product marking"]
[null,null,"PAS-ALU-PV-03","PACKING / SHIPPING  -  VISUAL INSPECTION","Change of packing/shipping specification"]
[null,null,"PAS-ALU-EQ-01","LOGISTICS / CAPACITY / TESTING  -  EQUIPEMEMENT","Production from a new equipment/tool which uses a different technology or which due to its unique form or function can be expected to influence the integrity of the final product"]
[null,null,"PAS-ALU-EQ-02","LOGISTICS / CAPACITY / TESTING  -  EQUIPEMEMENT","Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool)"]
[null,null,"PAS-ALU-EQ-03","LOGISTICS / CAPACITY / TESTING  -  EQUIPEMEMENT","Change in final test equipment type that uses a different technology"]
[null,null,"PAS-ALU-PF-01","LOGISTICS / CAPACITY / TESTING  -  PROCESS FLOW","Manufacturing site transfer or movement of a part of production process to a different location/site"]
[null,null,"PAS-ALU-PF-02","LOGISTICS / CAPACITY / TESTING  -  PROCESS FLOW","Elimination or addition of a manufacturing process step"]
[null,null,"PAS-ALU-PF-03","LOGISTICS / CAPACITY / TESTING  -  PROCESS FLOW","Elimination of final electrical measurement / test flow block"]
[null,null,"PAS-ALU-QG-01","LOGISTICS / CAPACITY / TESTING  -  Q-GATE","Change of test coverage used by the supplier to ensure data sheet compliance (e.g., elimination/addition of electrical measurement/test flow block, relaxation/enhancement of monitoring procedure or sampling)"]

{"sheet":"13","index":16,"n_rows":39,"n_cols":5,"rows_kept":39,"cut":false,"hidden":true,"merged":[]}
[]
[null,null,"ID","Type","Remarks"]
[null,null,"PAS-NTC-AN-01","Any","Any change with impact on agreed upon technical contractual agreements"]
[null,null,"PAS-NTC-AN-02","Any","Any change with impact on processability/manufacturabiliy at customer, which is not covered in the matrix below."]
[null,null,"PAS-NTC-DS-01","DATA SHEET","Change of datasheet parameters/electrical specification (min./max./typ. values) and / or AC/DC specification"]
[null,null,"PAS-NTC-DS-02","DATA SHEET","Correction of data sheet or issue of errata"]
[null,null,"PAS-NTC-DS-03","DATA SHEET","Specification of additional parameters"]
[null,null,"PAS-NTC-MA-01","MATERIAL","Change of material composition - Ceramic Binder"]
[null,null,"PAS-NTC-MA-02","MATERIAL","Change of material composition - Ceramic"]
[null,null,"PAS-NTC-MA-03","MATERIAL","Change of material composition - Inner Electrode"]
[null,null,"PAS-NTC-MA-04","MATERIAL","Change of material composition - Encapsulation"]
[null,null,"PAS-NTC-MA-05","MATERIAL","Change of material composition - Lead material / Termination"]
[null,null,"PAS-NTC-MA-06","MATERIAL","Change of supplier of material"]
[null,null,"PAS-NTC-DE-01","DESIGN","Changes of termination, surface finish, shape, color, appearance or dimension structure - Lead Diameter"]
[null,null,"PAS-NTC-DE-02","DESIGN","Changes of termination, surface finish, shape, color, appearance or dimension structure - Termination Area"]
[null,null,"PAS-NTC-DE-03","DESIGN","Changes of termination, surface finish, shape, color, appearance or dimension structure - Internal Connection"]
[null,null,"PAS-NTC-DE-04","DESIGN","Changes of termination, surface finish, shape, color, appearance or dimension structure - Appearance"]
[null,null,"PAS-NTC-DE-05","DESIGN","Changes of inner construction - Electrode "]
[null,null,"PAS-NTC-DE-06","DESIGN","Changes of inner construction - Layer Thickness"]
[null,null,"PAS-NTC-DE-07","DESIGN","Changes of inner construction - Number of Layers"]
[null,null,"PAS-NTC-PR-01","PROCESS","Changes in process technology or manufacturing methods - Lamination"]
[null,null,"PAS-NTC-PR-02","PROCESS","Changes in process technology or manufacturing methods - Firing"]
[null,null,"PAS-NTC-PR-03","PROCESS","Changes in process technology or manufacturing methods - Dicing"]
[null,null,"PAS-NTC-PR-04","PROCESS","Changes in process technology or manufacturing methods - Termination"]
[null,null,"PAS-NTC-PR-05","PROCESS","Changes in process technology or manufacturing methods - Electrode apply"]
[null,null,"PAS-NTC-PR-06","PROCESS","Changes in process technology or manufacturing methods - Assembly"]
[null,null,"PAS-NTC-PR-07","PROCESS","Process integrity: tuning within specification"]
[null,null,"PAS-NTC-PN-01","PACKING / SHIPPING  -  NEW MATERIAL, CRITICAL DIMENSIONS","Packing / shipping specification change (loosening of tolerances)"]
[null,null,"PAS-NTC-PN-02","PACKING / SHIPPING  -  NEW MATERIAL, CRITICAL DIMENSIONS","Dry pack requirements change"]
[null,null,"PAS-NTC-PN-03","PACKING / SHIPPING  -  NEW MATERIAL, CRITICAL DIMENSIONS","Change of carrier (tray, reel)"]
[null,null,"PAS-NTC-PV-01","PACKING / SHIPPING  -  VISUAL INSPECTION","Change of labelling"]
[null,null,"PAS-NTC-PV-02","PACKING / SHIPPING  -  VISUAL INSPECTION","Change of product marking"]
[null,null,"PAS-NTC-PV-03","PACKING / SHIPPING  -  VISUAL INSPECTION","Change of packing/shipping specification"]
[null,null,"PAS-NTC-EQ-01","LOGISTICS / CAPACITY / TESTING  -  EQUIPEMEMENT","Production from a new equipment/tool which uses a different technology or which due to its unique form or function can be expected to influence the integrity of the final product"]
[null,null,"PAS-NTC-EQ-02","LOGISTICS / CAPACITY / TESTING  -  EQUIPEMEMENT","Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool)"]
[null,null,"PAS-NTC-EQ-03","LOGISTICS / CAPACITY / TESTING  -  EQUIPEMEMENT","Change in final test equipment type that uses a different technology"]
[null,null,"PAS-NTC-PF-01","LOGISTICS / CAPACITY / TESTING  -  PROCESS FLOW","Manufacturing site transfer or movement of a part of production process to a different location/site"]
[null,null,"PAS-NTC-PF-02","LOGISTICS / CAPACITY / TESTING  -  PROCESS FLOW","Elimination or addition of a manufacturing process step"]
[null,null,"PAS-NTC-QG-01","LOGISTICS / CAPACITY / TESTING  -  Q-GATE","Change of test coverage used by the supplier to ensure data sheet compliance (e.g., elimination/addition of electrical measurement/test flow block, relaxation/enhancement of monitoring procedure or sampling)"]

{"sheet":"14","index":17,"n_rows":39,"n_cols":5,"rows_kept":39,"cut":false,"hidden":true,"merged":[]}
[]
[null,null,"ID","Type","Remarks"]
[null,null,"PAS-PTC-AN-01","Any","Any change with impact on agreed upon technical contractual agreements"]
[null,null,"PAS-PTC-AN-02","Any","Any change with impact on processability/manufacturabiliy at customer, which is not covered in the matrix below."]
[null,null,"PAS-PTC-DS-01","DATA SHEET","Change of datasheet parameters/electrical specification (min./max./typ. values) and / or AC/DC specification"]
[null,null,"PAS-PTC-DS-02","DATA SHEET","Correction of data sheet or issue of errata"]
[null,null,"PAS-PTC-DS-03","DATA SHEET","Specification of additional parameters"]
[null,null,"PAS-PTC-MA-01","MATERIAL","Change of material composition - Ceramic Binder"]
[null,null,"PAS-PTC-MA-02","MATERIAL","Change of material composition - Ceramic"]
[null,null,"PAS-PTC-MA-03","MATERIAL","Change of material composition - Polymer"]
[null,null,"PAS-PTC-MA-04","MATERIAL","Change of material composition - Encapsulation"]
[null,null,"PAS-PTC-MA-05","MATERIAL","Change of material composition - Lead material / Termination"]
[null,null,"PAS-PTC-MA-06","MATERIAL","Change of supplier of material"]
[null,null,"PAS-PTC-DE-01","DESIGN","Changes of termination, surface finish, shape, color, appearance or dimension structure - Lead Diameter"]
[null,null,"PAS-PTC-DE-02","DESIGN","Changes of termination, surface finish, shape, color, appearance or dimension structure - Termination Area"]
[null,null,"PAS-PTC-DE-03","DESIGN","Changes of termination, surface finish, shape, color, appearance or dimension structure - Internal Connection"]
[null,null,"PAS-PTC-DE-04","DESIGN","Changes of termination, surface finish, shape, color, appearance or dimension structure - Appearance"]
[null,null,"PAS-PTC-DE-05","DESIGN","Changes of inner construction - Electrode "]
[null,null,"PAS-PTC-DE-06","DESIGN","Changes of inner construction - Layer Thickness"]
[null,null,"PAS-PTC-DE-07","DESIGN","Changes of inner construction - Number of Layers"]
[null,null,"PAS-PTC-PR-01","PROCESS","Changes in process technology or manufacturing methods - Lamination"]
[null,null,"PAS-PTC-PR-02","PROCESS","Changes in process technology or manufacturing methods - Firing"]
[null,null,"PAS-PTC-PR-03","PROCESS","Changes in process technology or manufacturing methods - Dicing"]
[null,null,"PAS-PTC-PR-04","PROCESS","Changes in process technology or manufacturing methods - Termination"]
[null,null,"PAS-PTC-PR-05","PROCESS","Changes in process technology or manufacturing methods - Electrode apply"]
[null,null,"PAS-PTC-PR-06","PROCESS","Changes in process technology or manufacturing methods - Assembly"]
[null,null,"PAS-PTC-PR-07","PROCESS","Process integrity: tuning within specification"]
[null,null,"PAS-PTC-PN-01","PACKING / SHIPPING  -  NEW MATERIAL, CRITICAL DIMENSIONS","Packing / shipping specification change (loosening of tolerances)"]
[null,null,"PAS-PTC-PN-02","PACKING / SHIPPING  -  NEW MATERIAL, CRITICAL DIMENSIONS","Dry pack requirements change"]
[null,null,"PAS-PTC-PN-03","PACKING / SHIPPING  -  NEW MATERIAL, CRITICAL DIMENSIONS","Change of carrier (tray, reel)"]
[null,null,"PAS-PTC-PV-01","PACKING / SHIPPING  -  VISUAL INSPECTION","Change of labelling"]
[null,null,"PAS-PTC-PV-02","PACKING / SHIPPING  -  VISUAL INSPECTION","Change of product marking"]
[null,null,"PAS-PTC-PV-03","PACKING / SHIPPING  -  VISUAL INSPECTION","Change of packing/shipping specification"]
[null,null,"PAS-PTC-EQ-01","LOGISTICS / CAPACITY / TESTING  -  EQUIPEMEMENT","Production from a new equipment/tool which uses a different technology or which due to its unique form or function can be expected to influence the integrity of the final product"]
[null,null,"PAS-PTC-EQ-02","LOGISTICS / CAPACITY / TESTING  -  EQUIPEMEMENT","Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool)"]
[null,null,"PAS-PTC-EQ-03","LOGISTICS / CAPACITY / TESTING  -  EQUIPEMEMENT","Change in final test equipment type that uses a different technology"]
[null,null,"PAS-PTC-PF-01","LOGISTICS / CAPACITY / TESTING  -  PROCESS FLOW","Manufacturing site transfer or movement of a part of production process to a different location/site"]
[null,null,"PAS-PTC-PF-02","LOGISTICS / CAPACITY / TESTING  -  PROCESS FLOW","Elimination or addition of a manufacturing process step"]
[null,null,"PAS-PTC-QG-01","LOGISTICS / CAPACITY / TESTING  -  Q-GATE","Change of test coverage used by the supplier to ensure data sheet compliance (e.g., elimination/addition of electrical measurement/test flow block, relaxation/enhancement of monitoring procedure or sampling)"]

{"sheet":"15","index":18,"n_rows":41,"n_cols":5,"rows_kept":41,"cut":false,"hidden":true,"merged":[]}
[]
[null,null,"ID","Type","Remarks"]
[null,null,"PAS-VDR-AN-01","Any","Any change with impact on agreed upon technical contractual agreements"]
[null,null,"PAS-VDR-AN-02","Any","Any change with impact on processability/manufacturabiliy at customer, which is not covered in the matrix below."]
[null,null,"PAS-VDR-DS-01","DATA SHEET","Change of datasheet parameters/electrical specification (min./max./typ. values) and / or AC/DC specification"]
[null,null,"PAS-VDR-DS-02","DATA SHEET","Correction of data sheet or issue of errata"]
[null,null,"PAS-VDR-DS-03","DATA SHEET","Specification of additional parameters"]
[null,null,"PAS-VDR-MA-01","MATERIAL","Change of material composition - Ceramic Binder"]
[null,null,"PAS-VDR-MA-02","MATERIAL","Change of material composition - Ceramic"]
[null,null,"PAS-VDR-MA-03","MATERIAL","Change of material composition - Electrode"]
[null,null,"PAS-VDR-MA-04","MATERIAL","Change of material composition - Encapsulation"]
[null,null,"PAS-VDR-MA-05","MATERIAL","Change of material composition - Lead material / Termination"]
[null,null,"PAS-VDR-MA-06","MATERIAL","Change of supplier of material"]
[null,null,"PAS-VDR-DE-01","DESIGN","Changes of termination, surface finish, shape, color, appearance or dimension structure - Lead Diameter"]
[null,null,"PAS-VDR-DE-02","DESIGN","Changes of termination, surface finish, shape, color, appearance or dimension structure - Termination Area"]
[null,null,"PAS-VDR-DE-03","DESIGN","Changes of termination, surface finish, shape, color, appearance or dimension structure - Internal Connection"]
[null,null,"PAS-VDR-DE-04","DESIGN","Changes of termination, surface finish, shape, color, appearance or dimension structure - Appearance"]
[null,null,"PAS-VDR-DE-05","DESIGN","Changes of inner construction - Electrode "]
[null,null,"PAS-VDR-DE-06","DESIGN","Changes of inner construction - Layer Thickness"]
[null,null,"PAS-VDR-DE-07","DESIGN","Changes of inner construction - Number of Layers"]
[null,null,"PAS-VDR-DE-08","DESIGN","Changes of inner construction - Grain size"]
[null,null,"PAS-VDR-DE-09","DESIGN","Changes of inner construction - Grain boundary size"]
[null,null,"PAS-VDR-PR-01","PROCESS","Changes in process technology or manufacturing methods - Lamination"]
[null,null,"PAS-VDR-PR-02","PROCESS","Changes in process technology or manufacturing methods - Firing"]
[null,null,"PAS-VDR-PR-03","PROCESS","Changes in process technology or manufacturing methods - Dicing"]
[null,null,"PAS-VDR-PR-04","PROCESS","Changes in process technology or manufacturing methods - Termination"]
[null,null,"PAS-VDR-PR-05","PROCESS","Changes in process technology or manufacturing methods - Electrode apply"]
[null,null,"PAS-VDR-PR-06","PROCESS","Changes in process technology or manufacturing methods - Assembly"]
[null,null,"PAS-VDR-PR-07","PROCESS","Process integrity: tuning within specification"]
[null,null,"PAS-VDR-PN-01","PACKING / SHIPPING  -  NEW MATERIAL, CRITICAL DIMENSIONS","Packing / shipping specification change (loosening of tolerances)"]
[null,null,"PAS-VDR-PN-02","PACKING / SHIPPING  -  NEW MATERIAL, CRITICAL DIMENSIONS","Dry pack requirements change"]
[null,null,"PAS-VDR-PN-03","PACKING / SHIPPING  -  NEW MATERIAL, CRITICAL DIMENSIONS","Change of carrier (tray, reel)"]
[null,null,"PAS-VDR-PV-01","PACKING / SHIPPING  -  VISUAL INSPECTION","Change of labelling"]
[null,null,"PAS-VDR-PV-02","PACKING / SHIPPING  -  VISUAL INSPECTION","Change of product marking"]
[null,null,"PAS-VDR-PV-03","PACKING / SHIPPING  -  VISUAL INSPECTION","Change of packing/shipping specification"]
[null,null,"PAS-VDR-EQ-01","LOGISTICS / CAPACITY / TESTING  -  EQUIPEMEMENT","Production from a new equipment/tool which uses a different technology or which due to its unique form or function can be expected to influence the integrity of the final product"]
[null,null,"PAS-VDR-EQ-02","LOGISTICS / CAPACITY / TESTING  -  EQUIPEMEMENT","Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool)"]
[null,null,"PAS-VDR-EQ-03","LOGISTICS / CAPACITY / TESTING  -  EQUIPEMEMENT","Change in final test equipment type that uses a different technology"]
[null,null,"PAS-VDR-PF-01","LOGISTICS / CAPACITY / TESTING  -  PROCESS FLOW","Manufacturing site transfer or movement of a part of production process to a different location/site"]
[null,null,"PAS-VDR-PF-02","LOGISTICS / CAPACITY / TESTING  -  PROCESS FLOW","Elimination or addition of a manufacturing process step"]
[null,null,"PAS-VDR-QG-01","LOGISTICS / CAPACITY / TESTING  -  Q-GATE","Change of test coverage used by the supplier to ensure data sheet compliance (e.g., elimination/addition of electrical measurement/test flow block, relaxation/enhancement of monitoring procedure or sampling)"]

{"sheet":"16","index":19,"n_rows":68,"n_cols":5,"rows_kept":68,"cut":false,"hidden":true,"merged":[]}
[]
[null,null,"ID","Type","Remarks"]
[null,null,"MEMS-AN-01","ANY","Any change with impact on agreed upon technical contractual agreements"]
[null,null,"MEMS-AN-02","ANY","Any change with impact on processability/manufacturability at customer, which is not covered in the matrix below."]
[null,null,"MEMS-DS-01","DATA SHEET","Change of datasheet parameters/electrical specification (min./max./typ. values) and/or AC/DC specification"]
[null,null,"MEMS-DS-02","DATA SHEET","Correction of data sheet or issue of errata"]
[null,null,"MEMS-DS-03","DATA SHEET","Specification of additional parameters"]
[null,null,"MEMS-DE-01","DESIGN","Design changes in active elements. 1)"]
[null,null,"MEMS-DE-02","DESIGN","Design changes in routing . 2)"]
[null,null,"MEMS-DE-03","DESIGN","MEMS (pressure Sensing Element) Design Change"]
[null,null,"MEMS-PW-01","PROCESS - WAFER PRODUCTION","New / change of wafer substrate material"]
[null,null,"MEMS-PW-02","PROCESS - WAFER PRODUCTION","New wafer diameter"]
[null,null,"MEMS-PW-03","PROCESS - WAFER PRODUCTION","New final wafer thickness (including pressure sensor membrane)"]
[null,null,"MEMS-PW-04","PROCESS - WAFER PRODUCTION","Change of electrically active doping/implantation element"]
[null,null,"MEMS-PW-05","PROCESS - WAFER PRODUCTION","Change of gate material / dielectrics"]
[null,null,"MEMS-PW-06","PROCESS - WAFER PRODUCTION","New / change of backside operation (grinding / metallization) "]
[null,null,"MEMS-PW-07","PROCESS - WAFER PRODUCTION","New / change of metallization / vias / contacts"]
[null,null,"MEMS-PW-08","PROCESS - WAFER PRODUCTION","New / change of passivation or die coating (without bare die)"]
[null,null,"MEMS-PW-09","PROCESS - WAFER PRODUCTION","Change in process technology not covered by any other type of change"]
[null,null,"MEMS-PW-10","PROCESS - WAFER PRODUCTION","Process integrity: tuning within specification"]
[null,null,"MEMS-PW-11","PROCESS - WAFER PRODUCTION","Change of wafer supplier."]
[null,null,"MEMS-PW-12","PROCESS - WAFER PRODUCTION","Change of specified wafer process sequence (deletion and/or additional process step)"]
[null,null,"MEMS-PW-13","PROCESS - WAFER PRODUCTION","Move all or parts of production to a different wafer fab site."]
[null,null,"MEMS-PW-14","PROCESS - WAFER PRODUCTION","Lithography"]
[null,null,"MEMS-PW-15","PROCESS - WAFER PRODUCTION","Oxide / Interlayer Dielectric"]
[null,null,"MEMS-PW-16","PROCESS - WAFER PRODUCTION","MEMS (pressure Sensing Element) specific process"]
[null,null,"MEMS-BD-01","BARE DIE","New final wafer thickness"]
[null,null,"MEMS-BD-02","BARE DIE","Change of top metallization or bond pad stack"]
[null,null,"MEMS-BD-03","BARE DIE","New / change of backside metallization"]
[null,null,"MEMS-BD-04","BARE DIE","Change of wafer setup or number of possible good dies on wafer."]
[null,null,"MEMS-BD-05","BARE DIE","Change of optical appearance of wafer edge region (like imide coverage or edge exclusion)"]
[null,null,"MEMS-BD-06","BARE DIE","Die scribe or separation"]
[null,null,"MEMS-BD-07","BARE DIE","Die Preparation / Clean"]
[null,null,"MEMS-BD-08","BARE DIE","New / change of passivation or die coating "]
[null,null,"MEMS-WB-01","WAFER BUMPING","Redistribution Layer"]
[null,null,"MEMS-WB-02","WAFER BUMPING","Under Bump Material"]
[null,null,"MEMS-WB-03","WAFER BUMPING","Bump Material / Metal System (internal)"]
[null,null,"MEMS-WB-04","WAFER BUMPING","Bump Site Transfer"]
[null,null,"MEMS-PA-01","PROCESS - ASSEMBLY","New Package"]
[null,null,"MEMS-PA-02","PROCESS - ASSEMBLY","Change of leadframe base material"]
[null,null,"MEMS-PA-03","PROCESS - ASSEMBLY","Change in leadframe dimensions"]
[null,null,"MEMS-PA-04","PROCESS - ASSEMBLY","Change of lead frame finishing material / area (internal)"]
[null,null,"MEMS-PA-05","PROCESS - ASSEMBLY","Change of lead and heat slug plating material/plating thickness (external)"]
[null,null,"MEMS-PA-06","PROCESS - ASSEMBLY","Bump Material / Metal System (internal)"]
[null,null,"MEMS-PA-07","PROCESS - ASSEMBLY","Die attach material"]
[null,null,"MEMS-PA-08","PROCESS - ASSEMBLY","Change of wire bonding\n"]
[null,null,"MEMS-PA-09","PROCESS - ASSEMBLY","Substrate / Interposer"]
[null,null,"MEMS-PA-10","PROCESS - ASSEMBLY","Die Overcoat / Underfill"]
[null,null,"MEMS-PA-11","PROCESS - ASSEMBLY","Change of mold compound / encapsulation material"]
[null,null,"MEMS-PA-12","PROCESS - ASSEMBLY","Change of hermetic sealing"]
[null,null,"MEMS-PA-13","PROCESS - ASSEMBLY","Change of product marking"]
[null,null,"MEMS-PA-14","PROCESS - ASSEMBLY","Change in process technology\n(e.g. trim and form, leadframe preparation …)"]
[null,null,"MEMS-PA-15","PROCESS - ASSEMBLY","Process integrity: tuning within specification"]
[null,null,"MEMS-PA-16","PROCESS - ASSEMBLY","Change of direct material supplier"]
[null,null,"MEMS-PA-17","PROCESS - ASSEMBLY","Change of specified assembly process sequence (deletion and/or additional process step)"]
[null,null,"MEMS-PA-18","PROCESS - ASSEMBLY"," Move all or parts of production to a different assembly site."]
[null,null,"MEMS-PA-19","PROCESS - ASSEMBLY","Die scribe or separation"]
[null,null,"MEMS-PA-20","PROCESS - ASSEMBLY","Die Preparation / Clean"]
[null,null,"MEMS-PA-21","PROCESS - ASSEMBLY","Molding / Encapsulation process"]
[null,null,"MEMS-PS-01","PACKING/SHIPPING","Packing/shipping specification change"]
[null,null,"MEMS-PS-02","PACKING/SHIPPING","Dry pack requirements change "]
[null,null,"MEMS-PS-03","PACKING/SHIPPING","Change of carrier (tray, reel)"]
[null,null,"MEMS-PS-04","PACKING/SHIPPING","Change of labelling"]
[null,null,"MEMS-EQ-01","EQUIPMENT","Production from a new equipment/tool which uses a different basic technology or which due to its unique form or function can be expected to influence the integrity of the final product"]
[null,null,"MEMS-EQ-02","EQUIPMENT","Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool) without change of process."]
[null,null,"MEMS-EQ-03","EQUIPMENT","Change in final test equipment type leading to a different test concept."]
[null,null,"MEMS-TF-01","TEST FLOW","Move of all or part of electrical wafer test and/or final test to a different test site."]
[null,null,"MEMS-QG-01","Q-GATE","Change of the test coverage/testing process flow used by the supplier to ensure data sheet compliance (e.g. elimination/addition of electrical measurement/test flow block; relaxation/enhancement of monitoring procedure or sampling)"]

{"sheet":"Example Customer Feedback","index":20,"n_rows":40,"n_cols":11,"rows_kept":40,"cut":false,"hidden":false,"merged":[[1,9,5,9],[38,1,38,2],[38,3,38,8],[39,1,39,2],[39,3,39,8],[35,1,35,2],[35,3,35,8],[36,1,36,2],[36,3,36,8],[37,1,37,2],[30,1,30,2],[30,3,30,8],[37,3,37,8],[31,1,31,2],[31,3,31,8],[32,1,32,2],[32,3,32,8],[33,1,33,8],[34,1,34,8],[26,1,26,8],[27,1,27,8],[28,1,28,2],[28,3,28,8],[29,1,29,2],[29,3,29,8],[24,1,25,1],[24,2,24,4],[25,2,25,8],[24,7,24,8],[24,5,24,6],[19,1,20,1],[19,2,19,8],[20,2,20,8],[21,1,22,1],[21,2,21,8],[22,2,22,8],[0,0,122,0],[0,1,0,8],[1,1,1,8],[2,1,2,8],[3,1,3,2],[3,3,3,4],[3,5,3,6],[3,7,3,8],[11,1,12,1],[11,2,11,8],[14,2,14,4],[17,1,18,1],[17,2,17,8],[18,2,18,8],[15,2,16,8],[12,2,12,8],[4,1,4,8],[15,1,16,1],[6,2,6,4],[7,2,7,8],[8,2,8,8],[9,1,10,1],[9,2,9,8],[10,2,10,8],[6,5,6,6],[6,7,6,8],[14,7,14,8],[14,5,14,6]]}
[null,"Customer Feedback/Approval Form"]
[null,"Title of PCN:",null,null,null,null,null,null,null,{"$f":"Category!E1","v":"Form  provided  by ZVEI - Revision 5.0"}]
[null,{"$f":"IF(#REF!=\"\",\"\",#REF!)","v":{"$error":"#REF!"}}]
[null,"Customer PCN No.",null,"PCN4567",null,"Supplier PCN No.",null,{"$f":"IF(#REF!=\"\",\"\",#REF!)","v":{"$error":"#REF!"}}]
[null,"Please check the appropriate box below:"]
[]
[null,null,"1. Feedback",null,null,"date:",null,"2012-01-28"]
[null,null,"We agree with this proposed change for the parts as listed in chapter 11. Affected parts.\nApproval letter will be sent in written form.",null,null,null,null,null,null,null," "]
[null,null,"We agree with this proposed change schedule and will start with the PCN Process. Approval letter will be sent in written form"]
[null,null,"We disapprove because:"]
[null,null,null,null,null,null,null,null,null,null," "]
[null,null,"Remark:"]
[null,null,"At the moment we do not agree to your change. We point out that refering to our specification the parts have to be delivered unchanged until the necessary measures at our company finished to assure quality and to introduce the change at our company, and you have got our agreement to deliver the changed version."]
[]
[null,null,"2. Feedback",null,null,"date:",null,"2012-02-14"]
[null,null,"We acknowledge acknowledge qualification / validation as assigned in chapter 8 of the PCN."]
[]
[null,null,"We need more information:",null,null,null,null,null,null,null," "]
[]
[null," ","We need the following samples:"]
[]
[null,null,"Estimated closing date for PCN:"]
[null," "]
[]
[null,null,"Final Feedback/Approval",null,null,"date:"]
[]
[]
[null,"Sender:                                        "]
[null,"Company:              "]
[null,"Name:"]
[null,"Address/Location:"]
[null,"Signature:                                                          "]
[null,"Date:"]
[]
[null,"Please return to: [your Sales partner]                          "]
[null,"Name:",null,{"$f":"IF(#REF!=\"\",\"\",#REF!)","v":{"$error":"#REF!"}}]
[null,"Address/Location:"]
[null,"Phone:",null,{"$f":"IF(#REF!=\"\",\"\",#REF!)","v":{"$error":"#REF!"}}]
[null,"Fax:"]
[null,"Email:",null,{"$f":"IF(#REF!=\"\",\"\",#REF!)","v":{"$error":"#REF!"}}]

{"sheet":"Information Note","index":21,"n_rows":44,"n_cols":12,"rows_kept":44,"cut":false,"hidden":false,"merged":[[1,11,8,11],[39,1,39,10],[41,1,41,10],[42,1,42,6],[42,7,42,10],[38,1,38,10],[36,1,36,3],[36,4,36,5],[36,6,36,10],[33,1,33,3],[33,4,33,10],[35,1,35,10],[28,1,28,10],[29,1,29,3],[29,4,29,10],[30,1,30,3],[30,4,30,10],[32,1,32,10],[23,1,23,3],[23,4,23,6],[23,7,23,10],[26,1,26,3],[26,4,26,6],[26,7,26,10],[24,1,24,3],[24,4,24,6],[24,7,24,10],[25,1,25,3],[25,4,25,6],[25,7,25,10],[21,4,21,6],[21,7,21,10],[22,1,22,3],[22,4,22,6],[22,7,22,10],[15,1,15,3],[15,4,15,6],[15,7,15,10],[20,1,20,10],[16,1,16,3],[16,4,16,6],[16,7,16,10],[17,1,17,3],[17,4,17,6],[17,7,17,10],[13,1,13,3],[13,4,13,6],[13,7,13,10],[14,1,14,3],[14,4,14,6],[14,7,14,10],[10,1,10,3],[10,4,10,10],[11,1,11,3],[11,4,11,10],[12,1,12,10],[7,1,7,10],[8,1,8,10],[9,1,9,3],[9,4,9,10],[4,1,4,3],[4,4,4,10],[5,1,5,3],[5,4,5,10],[0,1,0,10],[1,1,1,10],[2,2,2,3],[2,4,2,10],[3,1,3,3],[3,4,3,10]]}
[null,"Standardized Information Note (IN)"]
[null,"1. Information Note basic data",null,null,null,null,null,null,null,null,null,{"$f":"Category!E1","v":"Form  provided  by ZVEI - Revision 5.0"}]
[null,"1.1 Company"]
[null,"1.2 Information Note  No."]
[null,"1.3 Title of IN"]
[null,"1.4 Issue date"]
[]
[null,"2. Contact"]
[null,"2.1 Contact supplier"]
[null,"2.1.1 Name \n"]
[null,"2.1.2 Phone\n"]
[null,"2.1.3 Email\n"]
[null,"2.2 Team supplier (optional)\n"]
[null,"2.2.1 Name (optional)\n",null,null,"2.2.2 Phone (optional)\n",null,null,"2.2.3 Email (optional)"]
[]
[]
[]
[]
[]
[]
[null,"3. Description "]
[null,null,null,null,"Old",null,null,"New"]
[null,"Description #1",null,null,null,null,null," "]
[null,"Description #2"]
[null,"Description #3"]
[null,"Description #4"]
[null,"Description #5"]
[]
[null,"4. Reason / motivation"]
[null,"4.1 Motivation",null,null," "]
[null,"4.2 Additional explanation (optional)"]
[]
[null,"5. Marking of parts / traceability"]
[null,"5.1 Description"]
[]
[null,"6. Timing / schedule"]
[null,"6.1 Intended start of delivery"]
[]
[null,"7. Attachments (e.g. additional documentation, pictures, part list….)"]
[]
[]
[null,"8. Affected parts"]
[null,"8.1 Current",null,null,null,null,null,"8.2 New (if applicable)"]
[null,"8.1.1 Customer Part No.\n","8.1.2 Supplier Part Name","8.1.3 \nSupplier Part No. (optional) ","8.1.4 Package Name","8.1.5 \nPart Description (optional)","8.1.6\nAdditional Part \nInformation (optional)","8.2.2 Supplier Part Name","8.2.3 \nSupplier Part No. (optional) ","8.2.4 Package Name","8.2.6\nAdditional Part \nInformation (optional)"]

{"sheet":"Example Information Note","index":22,"n_rows":45,"n_cols":12,"rows_kept":45,"cut":false,"hidden":false,"merged":[[1,11,8,11],[0,1,0,10],[1,1,1,10],[2,2,2,3],[2,4,2,10],[3,1,3,3],[3,4,3,10],[4,1,4,3],[4,4,4,10],[5,1,5,3],[5,4,5,10],[7,1,7,10],[8,1,8,10],[9,4,9,10],[11,1,11,3],[11,4,11,10],[12,1,12,10],[13,1,13,3],[13,4,13,6],[13,7,13,10],[10,1,10,3],[10,4,10,10],[9,1,9,3],[14,1,14,3],[14,4,14,6],[14,7,14,10],[15,1,15,3],[15,4,15,6],[15,7,15,10],[16,1,16,3],[16,4,16,6],[16,7,16,10],[17,1,17,3],[17,4,17,6],[17,7,17,10],[20,1,20,10],[21,4,21,6],[21,7,21,10],[22,1,22,3],[22,4,22,6],[22,7,22,10],[23,1,23,3],[23,4,23,6],[23,7,23,10],[24,1,24,3],[24,4,24,6],[24,7,24,10],[32,1,32,10],[25,1,25,3],[25,4,25,6],[25,7,25,10],[26,1,26,3],[26,4,26,6],[26,7,26,10],[28,1,28,10],[29,1,29,3],[29,4,29,10],[30,1,30,3],[30,4,30,10],[41,1,41,10],[33,1,33,3],[33,4,33,10],[35,1,35,10],[42,1,42,6],[42,7,42,10],[36,1,36,3],[36,4,36,5],[36,6,36,10],[38,1,38,10],[39,1,39,10]]}
[null,"Standardized Information Note (IN)"]
[null,"1. Information Note basic data",null,null,null,null,null,null,null,null,null,{"$f":"Category!E1","v":"Form  provided  by ZVEI - Revision 5.0"}]
[null,"1.1 Company",null,null,"ZVEI - Zentralverband Elektrotechnik- und Elektronikindustrie e.V. \n\nZVEI-German Electrical and Electronic Manufacturers`Association "]
[null,"1.2 Information Note  No.",null,null,"e.g.CM1234567"]
[null,"1.3 Title of IN",null,null,"e.g. New company lable and new colour of shipment boxes"]
[null,"1.4 Issue date",null,null,"2012-01-01"]
[]
[null,"2. Contact"]
[null,"2.1 Contact supplier"]
[null,"2.1.1 Name \n",null,null,"Mr. Mustermann"]
[null,"2.1.2 Phone\n",null,null,"+49 123 456789"]
[null,"2.1.3 Email\n",null,null,"max.mustermann@newcompany.com"]
[null,"2.2 Team supplier (optional)\n"]
[null,"2.2.1 Name (optional)\n",null,null,"2.2.2 Phone (optional)\n",null,null,"2.2.3 Email (optional)"]
[null,"Carl Clever",null,null,"+49 123 987654",null,null,"carl.clever@newcompany.com"]
[]
[]
[]
[]
[]
[null,"3. Description "]
[null,null,null,null,"Old",null,null,"New"]
[null,"Description #1",null,null,"zvei",null,null,"ZVEI"]
[null,"Description #2",null,null,"blue paper boxes (outer packaging)",null,null,"blue paper boxes with two red dots (outer packaging)"]
[null,"Description #3"]
[null,"Description #4"]
[null,"Description #5"]
[]
[null,"4. Reason / motivation"]
[null,"4.1 Motivation",null,null," e.g. New corporate design / corporate identity"]
[null,"4.2 Additional explanation (optional)"]
[]
[null,"5. Marking of parts / traceability"]
[null,"5.1 Description",null,null,"e.g. New corporate design / corporate identity"]
[]
[null,"6. Timing / schedule"]
[null,"6.1 Intended start of delivery",null,null,"2012-02-01"]
[]
[null,"7. Attachments (e.g. additional documentation, pictures, part list….)"]
[]
[]
[null,"8. Affected parts"]
[null,"8.1 Current",null,null,null,null,null,"8.2 New (if applicable)"]
[null,"8.1.1 Customer Part No.\n","8.1.2 Supplier Part Name","8.1.3 \nSupplier Part No. (optional) ","8.1.4 Package Name","8.1.5 \nPart Description (optional)","8.1.6\nAdditional Part \nInformation (optional)","8.2.2 Supplier Part Name","8.2.3 \nSupplier Part No. (optional) ","8.2.4 Package Name","8.2.6\nAdditional Part \nInformation (optional)"]
[null,"see \nchapter 7","see \nchapter 7",null,"see \nchapter 7",null,null,"see \nchapter 7",null,"see \nchapter 7"]