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03.06.2024

Technical Guideline – TLF 0214 Validation of Low Voltage Automotive Connectors

This technical guideline represents a non-binding technical description of test procedures for automotive connectors up to 60 V DC. Representatives of the connector manufacturers in the ZVEI…

25.01.2024

Report General Assembly, Electronic Components and Systems Division and PCB and Electronic Systems Division

The report on the 2023 General Meeting of the two associations Electronic Components and Systems (ECS) and Printed Circuit Boards and Electronic Systems (PCB-ES) informs the reader about current…

09.06.2022

Towards an ambitious, value-adding and realistic EU Chips Act

In the next decades, Europe's downstream industries will need both high-performance processors in smaller structure sizes and power semiconductors, sensors or microelectromechanical systems (MEMS)…

25.04.2022

EU Chips Act must make Europe more attractive for investment

In order to avoid supply bottlenecks in the future, it is necessary to significantly build up and expand the semiconductor industry and reduce one-sided dependencies in international competition.…

04.11.2021 | Europe

Semiconductor Strategy for Germany and Europe - Discussion Paper

ZVEI e.V. has published the paper "Semiconductor Strategy for Germany and Europe", which outlines the first steps towards a comprehensive, long-term, sustainable and effective strategy to strengthen…

01.12.2020

Software for Safety-Related Automotive Systems (Best Practice Guideline)

This guideline provides lessons-learned, experiences and best practices related to the application of ISO 26262 for the development of software.  Version 2

15.11.2017

EMS: Services backstage – added Value Under the Radar

Beyond the traditional EMS basic services – the three pillars of “development, production and after-sales service” – there are a number of processes running in the background – backstage services –…

10.11.2017

Guidelines Rework of Electronic Assemblies – Qualifiable Processes for Rework

The guideline is intended to show customers as well as manufacturers possible process limits and process specifications for the rework of electronic assemblies. Concrete risks and neuralgic points…

21.07.2017

Guideline Generic IC EMC Test Specification Version 2.1

This document defines common tests characterising the EMC behaviour of integrated circuits (ICs) in terms of RF emission and RF immunity in the frequency range from 150 kHz up to 3 GHz as well as…

04.05.2017

Successful Ceramic Solutions - Basic technology for microelectronic systems

Reliability, high frequency, high currents, mechanical strength, pressure stability and biocompatibility are excellent properties of ceramic microcircuits. This is why they can be used especially…

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