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The guideline is intended to show customers as well as manufacturers possible process limits and process specifications for the rework of electronic assemblies.
Concrete risks and neuralgic points within the entire process design are pointed out, as well as recommendations for the implementation under consideration of the respective framework conditions of the procedures and processes.
The content is based on the relevant previous knowledge and individual experience of all ZVEI working group members involved, as well as on the knowledge gained from specially designed test modules.