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Results: 27

09.06.2022

Towards an ambitious, value-adding and realistic EU Chips Act

In the next decades, Europe's downstream industries will need both high-performance processors in smaller structure sizes and power semiconductors, sensors or microelectromechanical systems (MEMS)…

25.04.2022

EU Chips Act must make Europe more attractive for investment

In order to avoid supply bottlenecks in the future, it is necessary to significantly build up and expand the semiconductor industry and reduce one-sided dependencies in international competition.…

04.11.2021 | Europe

Semiconductor Strategy for Germany and Europe - Discussion Paper

ZVEI e.V. has published the paper "Semiconductor Strategy for Germany and Europe", which outlines the first steps towards a comprehensive, long-term, sustainable and effective strategy to strengthen…

25.09.2019

Report General Assembly 2021, Electronic Components and Systems Division and PCB and Electronic Systems Division

The report on the 2021 General Meeting of the two associations Electronic Components and Systems (ECS) and Printed Circuit Boards and Electronic Systems (PCB-ES) informs the reader about…

19.06.2019

Joint Position of BV CERAMIS, JEITA and ZVEI Inside the Electrical Industry’s Value Chain

Lead oxides and complex oxides containing lead, which are well known constituents of ceramics, were added to the 8th revision of the SVHC candidate list of the EU REACH regulation (EC) No 1907/2006…

19.06.2019

Joint Position of BVGLAS, JEITA and ZVEI inside the Electrical Industry’s Value Chain

Lead oxides and complex oxides containing lead, which are well known constituents of glass, were added to the 8th revision of the SVHC candidate list of the EU REACH regulation ((EC) No 1907/2006)…

19.11.2018

Technical Cleanliness in Electrical Engineering (Guideline, 2nd edition)

The first edition of the guideline on component cleanliness was published in 2013. Our understanding of technical cleanliness has significantly increased in the meantime.  In addition, VDA 19…

15.11.2017

EMS: Services backstage – added Value Under the Radar

Beyond the traditional EMS basic services – the three pillars of “development, production and after-sales service” – there are a number of processes running in the background – backstage services –…

02.11.2017

White Paper "Benchmarking IC Development for Automotive Applications"

The request for individual mobility in our society is constantly rising. Today and probably for the next decade the individual as well as commercial demands for mobility solutions are mainly…

21.07.2017

Guideline Generic IC EMC Test Specification Version 2.1

This document defines common tests characterising the EMC behaviour of integrated circuits (ICs) in terms of RF emission and RF immunity in the frequency range from 150 kHz up to 3 GHz as well as…

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