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This technical guideline represents a non-binding technical description of test procedures for automotive connectors up to 60 V DC. Representatives of the connector manufacturers in the ZVEI…

The report on the 2023 General Meeting of the two associations Electronic Components and Systems (ECS) and Printed Circuit Boards and Electronic Systems (PCB-ES) informs the reader about current…

Denmark, Germany, the Netherlands, Norway and Sweden have made a joint proposal to restrict per- and polyfluorinated alkyl substances (PFAS) in Europe under the European REACH Regulation. The…

In the next decades, Europe's downstream industries will need both high-performance processors in smaller structure sizes and power semiconductors, sensors or microelectromechanical systems (MEMS)…

In order to avoid supply bottlenecks in the future, it is necessary to significantly build up and expand the semiconductor industry and reduce one-sided dependencies in international competition.…

ZVEI e.V. has published the paper "Semiconductor Strategy for Germany and Europe", which outlines the first steps towards a comprehensive, long-term, sustainable and effective strategy to strengthen…

Lead oxides and complex oxides containing lead, which are well known constituents of ceramics, were added to the 8th revision of the SVHC candidate list of the EU REACH regulation (EC) No 1907/2006…

Lead oxides and complex oxides containing lead, which are well known constituents of glass, were added to the 8th revision of the SVHC candidate list of the EU REACH regulation ((EC) No 1907/2006)…

The first edition of the guideline on component cleanliness was published in 2013. Our understanding of technical cleanliness has significantly increased in the meantime.  In addition, VDA 19…

Beyond the traditional EMS basic services – the three pillars of “development, production and after-sales service” – there are a number of processes running in the background – backstage services –…