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The European Chips Act was an important response to the COVID-19 crisis and has brought remarkable progress. However, its implementation and geopolitical challenges show that a strategic framework…

This technical guideline represents a non-binding technical description of test procedures for automotive connectors up to 60 V DC. Representatives of the connector manufacturers in the ZVEI…

The report on the 2023 General Meeting of the two associations Electronic Components and Systems (ECS) and Printed Circuit Boards and Electronic Systems (PCB-ES) informs the reader about current…

In the next decades, Europe's downstream industries will need both high-performance processors in smaller structure sizes and power semiconductors, sensors or microelectromechanical systems (MEMS)…

In order to avoid supply bottlenecks in the future, it is necessary to significantly build up and expand the semiconductor industry and reduce one-sided dependencies in international competition.…

ZVEI e.V. has published the paper "Semiconductor Strategy for Germany and Europe", which outlines the first steps towards a comprehensive, long-term, sustainable and effective strategy to strengthen…

This guideline provides lessons-learned, experiences and best practices related to the application of ISO 26262 for the development of software.  Version 2

Beyond the traditional EMS basic services – the three pillars of “development, production and after-sales service” – there are a number of processes running in the background – backstage services –…

The guideline is intended to show customers as well as manufacturers possible process limits and process specifications for the rework of electronic assemblies. Concrete risks and neuralgic points…

This document defines common tests characterising the EMC behaviour of integrated circuits (ICs) in terms of RF emission and RF immunity in the frequency range from 150 kHz up to 3 GHz as well as…